Xing Fan, Yi Tao, Wangwei Zhang, Chen Li, Bingxin Li, Ziyuan Ma, Zhiming Geng, Xue-Jun Yan, Ming-Hui Lu, Di Wu, Deyu Li, Hong Lu, Yan-Feng Chen
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引用次数: 0
Abstract
It has been a persistent challenge to experimentally distinguish the contribution of electron-phonon coupling on interfacial thermal conductance from phonon-dominated pathways. The LaAlO3/SrTiO3 (LAO/STO) interface offers a unique platform to address this, at which two-dimensional electron gas (2DEG) can be formed or absent depending on whether the LAO is terminated by TiO2 or SrO during the growth, and enables a direct comparison of thermal transport with and without interfacial free electrons. Using time-domain thermoreflectance measurements, it is demonstrated that the interfacial thermal conductance is enhanced by 35–40% in the 2DEG-active interface compared to its 2DEG-free counterpart. This enhancement provides direct experimental evidence of electron-phonon coupling as an additional thermal transport channel, distinct from phonon contributions. The extracted electron-phonon coupling coefficient (G≈1016 W m−3 K−1) aligns with the first-principles predictions for oxide interfaces. Crucially, the results resolve the long-standing ambiguity in decoupling electronic and phononic thermal pathways, offering a generalizable framework to quantify electron-phonon interactions at metal-dielectric heterointerfaces.
从实验上区分电子-声子耦合对界面热导的贡献和声子主导的途径一直是一个持续的挑战。LaAlO3/SrTiO3 (LAO/STO)界面为解决这一问题提供了一个独特的平台,根据生长过程中LAO是否被TiO2或SrO终止,可以形成或不存在二维电子气(2DEG),并且可以直接比较有和没有界面自由电子的热传输。利用时域热反射测量结果表明,与不含2DEG的界面相比,2DEG活性界面的界面导热系数提高了35-40%。这种增强提供了直接的实验证据,证明电子-声子耦合是一个额外的热传输通道,不同于声子的贡献。提取的电子-声子耦合系数(G≈1016 W m−3 K−1)与氧化物界面的第一性原理预测一致。至关重要的是,结果解决了长期存在的解耦电子和声子热途径的模糊性,提供了一个可推广的框架来量化金属-介电异质界面上的电子-声子相互作用。
期刊介绍:
Advanced Electronic Materials is an interdisciplinary forum for peer-reviewed, high-quality, high-impact research in the fields of materials science, physics, and engineering of electronic and magnetic materials. It includes research on physics and physical properties of electronic and magnetic materials, spintronics, electronics, device physics and engineering, micro- and nano-electromechanical systems, and organic electronics, in addition to fundamental research.