Qihu Wu , Wenchang Wang , Zhiyao Ming , Tian Fang , Denghui Tang , Minxian Wu , Pengju Wang , Shuiping Qin , Naotoshi Mitsuzaki , Zhidong Chen
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引用次数: 0
Abstract
In this study, Se-Sb alloy coatings were successfully fabricated for the first time via constant potential electrodeposition from a choline chloride–ethylene glycol deep eutectic solvent. The correlation between deposition potential and the morphology, composition, crystal phase, optical, and electrical properties of the coatings was systematically investigated. The results showed that as the deposition potential shifted in the negative direction, the fibrous morphology of the coatings initially became denser and subsequently looser. Correspondingly, the Se content first decreased and then increased, while the Sb content exhibited the opposite trend. The crystalline structure was primarily characterized by an amorphous Sb2Se3 phase. Although both the bandgap and photocurrent response initially increased and then decreased with more negative deposition potentials, the coatings consistently exhibited excellent p-type semiconductor characteristics.
Chronoamperometry (CA) analysis indicated that the nucleation mechanism of Se-Sb alloys transitioned from diffusion-controlled three-dimensional (3D) progressive nucleation to diffusion-controlled 3D instantaneous nucleation as the deposition potential shifted from −0.45 V to −0.65 V. Furthermore, cyclic voltammetry (CV) analysis revealed an induced co-deposition mechanism: Se was first deposited on the FTO substrate, which subsequently induced the co-deposition of Se and Sb to form the Se-Sb alloy coatings. Finally, a comparison with coatings annealed at 300 °C demonstrated that annealing significantly improved the crystallinity, resulting in the formation of crystalline Sb2Se3. However, the photocurrent response decreased by a factor of 5.18. These findings suggest that the as-deposited Se-Sb alloy coatings exhibit superior photoelectrical performance compared to their annealed counterparts, highlighting their promising potential for photoelectric applications.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.