Nicholas Sturim;Premjeet Chahal;Matthew Hodek;John D. Albrecht;John Papapolymerou
{"title":"Miniaturized Millimeter-Wave Multilayer Filter Design Using Additive Manufacturing","authors":"Nicholas Sturim;Premjeet Chahal;Matthew Hodek;John D. Albrecht;John Papapolymerou","doi":"10.1109/TCPMT.2025.3564215","DOIUrl":null,"url":null,"abstract":"This article presents an innovative, fully additive manufactured approach to millimeter-wave multilayer circuits. An aerosol jet printer is used to fabricate a multilayer stepped-impedance low-pass filter. By leveraging the second layer for miniaturization, we achieve a more compact design. By precisely controlling conductor separation and utilizing 3-D printing technology, we were able to optimize the width of the high- and low-impedance segments for optimal filter performance. Two filter types were successfully fabricated: a low-pass microstrip filter and a low-pass stripline filter, both with a cutoff frequency near 29 GHz and exhibiting acceptable stopband attenuation. The stripline configuration allows for a 36% decrease in the stripline waveguide conductor area while achieving a great passband insertion loss of just 0.62 dB, enabled by aerosol jet printing (AJP). The line loss of both designs was characterized using a microstrip through line and a stripline through line. Both designs demonstrated low overall loss, with the microstrip line exhibiting a loss of 0.26 dB/mm and the stripline having a loss of 0.37 dB/mm at 29 GHz. This work demonstrates a multilayer integration solution and offers an advantage in reducing the size of RF circuits such as filter banks for next-generation integrated RF front ends.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 6","pages":"1170-1178"},"PeriodicalIF":3.0000,"publicationDate":"2025-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10976478/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This article presents an innovative, fully additive manufactured approach to millimeter-wave multilayer circuits. An aerosol jet printer is used to fabricate a multilayer stepped-impedance low-pass filter. By leveraging the second layer for miniaturization, we achieve a more compact design. By precisely controlling conductor separation and utilizing 3-D printing technology, we were able to optimize the width of the high- and low-impedance segments for optimal filter performance. Two filter types were successfully fabricated: a low-pass microstrip filter and a low-pass stripline filter, both with a cutoff frequency near 29 GHz and exhibiting acceptable stopband attenuation. The stripline configuration allows for a 36% decrease in the stripline waveguide conductor area while achieving a great passband insertion loss of just 0.62 dB, enabled by aerosol jet printing (AJP). The line loss of both designs was characterized using a microstrip through line and a stripline through line. Both designs demonstrated low overall loss, with the microstrip line exhibiting a loss of 0.26 dB/mm and the stripline having a loss of 0.37 dB/mm at 29 GHz. This work demonstrates a multilayer integration solution and offers an advantage in reducing the size of RF circuits such as filter banks for next-generation integrated RF front ends.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.