High-performance, low-area-overhead, and low-delay triple-node-upset self-recoverable latch design based on stacked transistors

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Hui Xu , Yue Dai , Ruijun Ma , Huaguo Liang , Zhengfeng Huang , Tianming Ni , Chuanjian Zhang , Xin Chen , Ye Tang
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引用次数: 0

Abstract

Due to the gradual reduction in the feature size of transistors in integrated circuits (ICs), triple-node-upsets (TNUs) caused by the striking of energetic particles in harsh radiation environments have become a considerable reliability concern for ICs. To overcome the limitations of current radiation-hardened designs regarding overhead and reliability, this paper proposes a high-performance, low-area-overhead, and low-delay TNU self-recoverable latch (HLLT) based on N-type stacked transistors for aerospace applications. The proposed HLLT latch comprises three symmetrical modules that protect each other. In addition, high-speed path and clock gating technology are employed to reduce delay overhead and power consumption, respectively. Simulation results show that, compared to five existing TNU-recoverable latches, the proposed HLLT latch achieves average reductions of 29.97 %, 57.12 %, 36.52 %, and 83.00 % in area overhead, power consumption, delay, and area-power-delay-product (APDP), respectively. Furthermore, the proposed HLLT latch has lower sensitivity and better stability to variations in PVT (Process, Voltage, Temperature).
基于堆叠晶体管的高性能、低面积开销、低延迟三节点扰流自恢复锁存器设计
由于集成电路(ic)中晶体管的特征尺寸逐渐减小,在恶劣辐射环境中由高能粒子撞击引起的三节点扰流(tnu)已经成为集成电路可靠性的一个相当大的问题。为了克服当前抗辐射设计在开销和可靠性方面的局限性,本文提出了一种基于n型堆叠晶体管的高性能、低面积开销、低延迟TNU自恢复锁存器(HLLT),用于航空航天应用。提出的HLLT锁存器包括三个对称的模块,相互保护。此外,采用高速路径和时钟门控技术分别降低延迟开销和功耗。仿真结果表明,与现有的5种tnu可恢复锁存器相比,提出的HLLT锁存器在面积开销、功耗、延迟和面积-功率延迟积(APDP)方面分别平均降低29.97%、57.12%、36.52%和83.00 %。此外,所提出的HLLT锁存器对PVT(过程、电压、温度)的变化具有较低的灵敏度和更好的稳定性。
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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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