Shuai Zhu;Maoliang Jian;Xiaoni Yang;Liang Chen;Li Deng;Lianqiao Yang
{"title":"Life Prediction of IGBT Across Working Condition via a CNN-Transformer Network","authors":"Shuai Zhu;Maoliang Jian;Xiaoni Yang;Liang Chen;Li Deng;Lianqiao Yang","doi":"10.1109/TDMR.2025.3567107","DOIUrl":null,"url":null,"abstract":"Insulated Gate Bipolar Transistors (IGBTs) are extensively utilized in a multitude of fields owing to their proficiency in power conversion and their dependable operation. Anticipating the service life of IGBTs to preemptively mitigate the repercussions of device failure, this research advances a novel lifespan forecasting methodology underpinned by a Convolutional Neural Network (CNN) and Transformer hybrid model. The methodology commences with accelerated aging power cycling tests within a range of temperature thresholds, utilizing the Siemens Power Tester to gather aging parameters at disparate junction temperatures. A pivotal observation is the alteration of the saturated voltage drop, VCE(ON), throughout the aging process, which is then harnessed as a critical aging indicator for model training. Following this, the accrued datasets from three distinct groups undergo a rigorous preprocessing phase. Subsequently, the proposed forecasting technique is deployed to predict lifespan across varying operating conditions. The empirical findings underscore that the model introduced in this paper, when predicated on the variations in saturated voltage drop, achieves markedly enhanced predictive fidelity in both single-step and multi-step forecasting scenarios, outperforming alternative comparative methodologies. Especially in single step prediction, the mean values of the coefficient of determination (R2), mean absolute error (MAE), and root mean square error (RMSE) are 0.996, 0.0016 and 0.0026, respectively.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 2","pages":"195-202"},"PeriodicalIF":2.3000,"publicationDate":"2025-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11004017/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Insulated Gate Bipolar Transistors (IGBTs) are extensively utilized in a multitude of fields owing to their proficiency in power conversion and their dependable operation. Anticipating the service life of IGBTs to preemptively mitigate the repercussions of device failure, this research advances a novel lifespan forecasting methodology underpinned by a Convolutional Neural Network (CNN) and Transformer hybrid model. The methodology commences with accelerated aging power cycling tests within a range of temperature thresholds, utilizing the Siemens Power Tester to gather aging parameters at disparate junction temperatures. A pivotal observation is the alteration of the saturated voltage drop, VCE(ON), throughout the aging process, which is then harnessed as a critical aging indicator for model training. Following this, the accrued datasets from three distinct groups undergo a rigorous preprocessing phase. Subsequently, the proposed forecasting technique is deployed to predict lifespan across varying operating conditions. The empirical findings underscore that the model introduced in this paper, when predicated on the variations in saturated voltage drop, achieves markedly enhanced predictive fidelity in both single-step and multi-step forecasting scenarios, outperforming alternative comparative methodologies. Especially in single step prediction, the mean values of the coefficient of determination (R2), mean absolute error (MAE), and root mean square error (RMSE) are 0.996, 0.0016 and 0.0026, respectively.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.