Sufia Shahin;Swati Deshwal;Anirban Kar;Mahdi Benkhelifa;Yogesh S. Chauhan;Hussam Amrouch
{"title":"CFET Beyond 3 nm: SRAM Reliability Under Design-Time and Run-Time Variability","authors":"Sufia Shahin;Swati Deshwal;Anirban Kar;Mahdi Benkhelifa;Yogesh S. Chauhan;Hussam Amrouch","doi":"10.1109/JXCDC.2025.3568622","DOIUrl":null,"url":null,"abstract":"This work investigates the reliability of complementary field-effect transistors (CFETs) by addressing both design-time variability arising from process variations and run-time variability due to temperature and aging effects. A rigorously calibrated TCAD model, validated against experimental CFET data, is employed to quantify the impact of metal gate granularity (MGG)-induced work-function variation (WFV) and random dopant fluctuation (RDF) on key device parameters, including the threshold voltage (<inline-formula> <tex-math>$V_{\\mathrm {TH}}$ </tex-math></inline-formula>), <sc>on</small>-state current (<inline-formula> <tex-math>$I_{\\mathrm {ON}}$ </tex-math></inline-formula>), and <sc>off</small>-state current (<inline-formula> <tex-math>$I_{\\mathrm {OFF}}$ </tex-math></inline-formula>). Temperature-dependent variability is systematically analyzed to further elucidate the behavior of these advanced devices. To capture the dynamic effects of aging, the reaction-diffusion (RD) framework—which accounts for defect generation due to negative bias temperature instability (NBTI)—is implemented in TCAD, enabling detailed modeling of trap generation and the corresponding <inline-formula> <tex-math>$V_{\\mathrm {TH}}$ </tex-math></inline-formula> shifts in p-type transistors under varying gate stress biases (<inline-formula> <tex-math>$V_{\\mathrm {GSTR}}$ </tex-math></inline-formula>) and operating temperatures. At the circuit level, a full array of 6T-static random access memory (SRAM) cells with the requisite peripheral circuits is simulated using SPICE after careful calibration of the industry-standard compact model of gate-all-around (BSIM-CMG) against the TCAD data. The variability analysis reveals that the access disturb margin achieves a cell sigma (<inline-formula> <tex-math>$\\mu /\\sigma $ </tex-math></inline-formula>) of 17.4 at nominal supply voltage, significantly exceeding the <inline-formula> <tex-math>$6\\sigma $ </tex-math></inline-formula> robustness criterion for read disturbances. Moreover, as the operating temperature increases from 300 to 398 K, the read static noise margin (RSNM) and hold static noise margin (HSNM) degrade by 13.7% and 6.37%, respectively, while the write static noise margin (WSNM) improves by 18.3%. These findings provide critical insights into the design tradeoffs and reliability challenges of CFET-based SRAMs.","PeriodicalId":54149,"journal":{"name":"IEEE Journal on Exploratory Solid-State Computational Devices and Circuits","volume":"11 ","pages":"51-59"},"PeriodicalIF":2.0000,"publicationDate":"2025-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10994809","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal on Exploratory Solid-State Computational Devices and Circuits","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/10994809/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
This work investigates the reliability of complementary field-effect transistors (CFETs) by addressing both design-time variability arising from process variations and run-time variability due to temperature and aging effects. A rigorously calibrated TCAD model, validated against experimental CFET data, is employed to quantify the impact of metal gate granularity (MGG)-induced work-function variation (WFV) and random dopant fluctuation (RDF) on key device parameters, including the threshold voltage ($V_{\mathrm {TH}}$ ), on-state current ($I_{\mathrm {ON}}$ ), and off-state current ($I_{\mathrm {OFF}}$ ). Temperature-dependent variability is systematically analyzed to further elucidate the behavior of these advanced devices. To capture the dynamic effects of aging, the reaction-diffusion (RD) framework—which accounts for defect generation due to negative bias temperature instability (NBTI)—is implemented in TCAD, enabling detailed modeling of trap generation and the corresponding $V_{\mathrm {TH}}$ shifts in p-type transistors under varying gate stress biases ($V_{\mathrm {GSTR}}$ ) and operating temperatures. At the circuit level, a full array of 6T-static random access memory (SRAM) cells with the requisite peripheral circuits is simulated using SPICE after careful calibration of the industry-standard compact model of gate-all-around (BSIM-CMG) against the TCAD data. The variability analysis reveals that the access disturb margin achieves a cell sigma ($\mu /\sigma $ ) of 17.4 at nominal supply voltage, significantly exceeding the $6\sigma $ robustness criterion for read disturbances. Moreover, as the operating temperature increases from 300 to 398 K, the read static noise margin (RSNM) and hold static noise margin (HSNM) degrade by 13.7% and 6.37%, respectively, while the write static noise margin (WSNM) improves by 18.3%. These findings provide critical insights into the design tradeoffs and reliability challenges of CFET-based SRAMs.
本研究通过解决由工艺变化引起的设计时可变性和由温度和老化影响引起的运行时可变性来研究互补场效应晶体管(cfet)的可靠性。采用严格校准的TCAD模型,对实验数据进行验证,量化金属栅粒度(MGG)诱导的功函数变化(WFV)和随机掺杂波动(RDF)对关键器件参数的影响,包括阈值电压($V_{\mathrm {TH}}$)、导通电流($I_{\mathrm {ON}}$)和关断电流($I_{\mathrm {OFF}}$)。系统地分析了温度相关的变异性,以进一步阐明这些先进设备的行为。为了捕捉老化的动态影响,在TCAD中实现了反应扩散(RD)框架,该框架解释了由于负偏置温度不稳定性(NBTI)而产生的缺陷,从而可以在不同栅极应力偏置($V_{\mathrm {GSTR}}$)和工作温度下对p型晶体管的陷阱产生和相应的$V_{\mathrm {TH}}$位移进行详细建模。在电路层面,在根据TCAD数据仔细校准行业标准紧凑型栅极全能(BSIM-CMG)模型后,使用SPICE模拟了具有必要外围电路的全阵列6t静态随机存取存储器(SRAM)单元。变异性分析表明,在标称电源电压下,接入干扰裕度达到17.4的cell sigma ($\mu /\sigma $),显著超过$6\sigma $对读干扰的鲁棒性准则。此外,当工作温度从300 K增加到398 K时,读取静态噪声裕度(RSNM)和保持静态噪声裕度(HSNM)下降了13.7%% and 6.37%, respectively, while the write static noise margin (WSNM) improves by 18.3%. These findings provide critical insights into the design tradeoffs and reliability challenges of CFET-based SRAMs.