Cavitation-driven nanosecond laser irradiation assisted chemical–mechanical-polishing (CMP) for atomic-scale material removal of 4H-SiC

IF 4.6 2区物理与天体物理 Q1 OPTICS

Optics and Laser Technology Pub Date : 2025-06-09 DOI:10.1016/j.optlastec.2025.113328

Zirui Wang , Yuguang Zhu , Yang Peng , Tianyu Zhang , Yongguang Wang , Qingsheng Liu , Haidong He , Chuanyang Wang

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引用次数: 0

Abstract

Silicon carbide (SiC) is one of the most promising three-generation semiconductor materials owing to its remarkable properties and numerous potential applications. Nevertheless, the polishing efficiency of hard-to-process single crystal SiC remains a significant challenge due to its high hardness and chemical inertness. A novel approach by employing nanosecond laser irradiation in deionized water as a pre-process for the chemical mechanical polishing (CMP) process was presented. By irradiating the Si-face in transverse and cross-scanning irradiation sequentially, the SiC wafers were processed with CMP using the eco-friendly polishing slurry. The polishing performance of underwater nanosecond laser assisted (UNLA)-CMP, including material removal rate (MRR) and surface roughness (R_a), was evaluated, and the mechanisms of underwater nanosecond laser irradiation of SiC surfaces were investigated. The results indicate that the proposed UNLA-CMP process can meet the various requirements for surface accuracy in the surface polishing of SiC wafers. The study offers a beneficial exploration of applying the post-treatment of underwater nanosecond laser irradiation to the efficient atomic-scale SiC-CMP process.

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空化驱动纳秒激光辅助化学机械抛光（CMP）去除4H-SiC原子尺度材料

碳化硅（SiC）以其优异的性能和广泛的应用前景成为最有前途的三代半导体材料之一。然而，由于其高硬度和化学惰性，难以加工的单晶SiC的抛光效率仍然是一个重大挑战。提出了一种利用纳秒激光辐照去离子水作为化学机械抛光（CMP）前处理的新方法。通过对硅面进行横向和交叉扫描辐照，采用生态友好型抛光浆对SiC晶圆进行CMP加工。研究了水下纳秒激光辅助(UNLA)-CMP的抛光性能，包括材料去除率（MRR）和表面粗糙度（Ra），并探讨了水下纳秒激光辐照SiC表面的机理。结果表明，所提出的UNLA-CMP工艺可以满足SiC晶圆表面抛光对表面精度的各种要求。该研究为将水下纳秒激光辐照后处理应用于高效的原子尺度SiC-CMP工艺提供了有益的探索。

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来源期刊

Optics and Laser Technology 物理-光学

CiteScore

8.50

自引率

10.00%

发文量

1060

审稿时长

3.4 months

期刊介绍： Optics & Laser Technology aims to provide a vehicle for the publication of a broad range of high quality research and review papers in those fields of scientific and engineering research appertaining to the development and application of the technology of optics and lasers. Papers describing original work in these areas are submitted to rigorous refereeing prior to acceptance for publication. The scope of Optics & Laser Technology encompasses, but is not restricted to, the following areas: •development in all types of lasers •developments in optoelectronic devices and photonics •developments in new photonics and optical concepts •developments in conventional optics, optical instruments and components •techniques of optical metrology, including interferometry and optical fibre sensors •LIDAR and other non-contact optical measurement techniques, including optical methods in heat and fluid flow •applications of lasers to materials processing, optical NDT display (including holography) and optical communication •research and development in the field of laser safety including studies of hazards resulting from the applications of lasers (laser safety, hazards of laser fume) •developments in optical computing and optical information processing •developments in new optical materials •developments in new optical characterization methods and techniques •developments in quantum optics •developments in light assisted micro and nanofabrication methods and techniques •developments in nanophotonics and biophotonics •developments in imaging processing and systems