Shenjiali Wang , Jian Wen , Luwei Feng , Xiaozhan Yang
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引用次数: 0
Abstract
High temperature resistance and broadband detection are crucial in the application of flexible photodetectors, and it is still challenging to achieve high quality performance using low-cost and simple fabrication methods. To widen the spectral response range and improve the photoperformance, a photoconductive PbS quantum dots (QDs)/Bi2S3 flexible photodetector was fabricated through physical vapor deposition and drop-coating processes on a flexible polyimide. This design is due to the excellent photoresponse of Bi2S3 in the ultraviolet and visible regions, and the remarkable tunability and respond of PbS QDs in the infrared band. The device has a broadband photoresponse under 365–1550 nm. The device has the maximum responsivity (R) of 3.59 mA/W and detectivity (D∗) of 4.34 × 1010 Jones under 638 nm illumination with a light intensity of 0.6 mW/cm2. And the response/recovery times are 0.35 s/0.45 s. The device exhibits excellent photoperformance even after multiple bends. When bent by 55 %, the photocurrent remains over 94 % of the initial value. Compared to Bi2S3 devices, PbS QDs/Bi2S3 flexible photodetectors have a 220-fold increase in on/off ratio. Moreover, the device can operate normally at 180 °C, demonstrating excellent temperature resistance characteristics. This work offers a new approach for designing high-performance flexible electronic devices with high temperature resistance and broadband response.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.