Monolithically Integrated Hydrogen-Terminated Diamond FET Logic Circuits

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yuesong Liang;Wei Wang;Genqiang Chen;Fei Wang;Yuxiang Du;Minghui Zhang;Yanfeng Wang;Hong-Xing Wang
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引用次数: 0

Abstract

Logic circuits are the first step toward integrated circuits. Here, we fabricated the monolithically E/R logic, direct coupled E/E logic, and E/D inverter logic circuit with respective loads of resistor, enhancement field-effect transistor (FET), and depletion FET using hydrogenated diamond and observed the performance of these logic circuits. The gain and voltage swing of E/R logic circuits are strongly influenced by the value of the load resistance, which are commonly employed in separate components. E/E logic circuit exhibits small voltage swing, low gain, and low noise margin. E/D logic circuits present significant advantages in terms of voltage swing, gain, noise margins, and power consumption over E/R and E/E logic circuits. The E/D mode circuit shows a logic voltage swing of −9.44 V, a voltage gain of 15.5 V/V, low-/high-noise margins of 0.82/7.07 V, and static power consumption of $10^{-{3}}$ W and proper functions up to at least $200~^{\circ }$ C at a supply voltage of −10 V. These results show great potential for diamond smart power integrated circuit application.
单片集成氢端金刚石场效应晶体管逻辑电路
逻辑电路是迈向集成电路的第一步。本文采用氢化金刚石制备了分别负载电阻、增强场效应晶体管(FET)和耗尽场效应晶体管的单片E/R逻辑、直接耦合E/E逻辑和E/D逆变逻辑电路,并观察了这些逻辑电路的性能。E/R逻辑电路的增益和电压摆幅受到负载电阻值的强烈影响,它们通常在单独的元件中使用。E/E逻辑电路具有电压摆幅小、增益低、噪声裕度低的特点。与E/R和E/E逻辑电路相比,E/D逻辑电路在电压摆幅、增益、噪声裕度和功耗方面具有显著优势。E/D模式电路的逻辑电压摆幅为−9.44 V,电压增益为15.5 V/V,低噪声/高噪声余量为0.82/7.07 V,静态功耗为$10^{-{3}}$ W,在电源电压为−10 V时,其正常功能可达$200~^{\circ}$ C。这些结果显示了金刚石智能电源集成电路应用的巨大潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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