Youngjin Shin;Nedeljko Karaulac;Winston Chern;Akintunde I. Akinwande
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引用次数: 0
Abstract
We demonstrate the first steps in engineering the anode of field emitter arrays (FEAs) for optimal vacuum packaging by studying a parallel anode-cathode configuration. As part of our study, we report an unexpected gate-controlled negative differential resistance (NDR) region in the output characteristics of FEA-based triodes. The FEA triode consists of an FEA cathode and a silicon MEMS anode that are separated by insulated standoffs to form a vacuum channel. The FEA cathode is an array of high-aspect nanowires connected in series with gated emitter tips. Electrons extracted by the gate-emitter voltage undergo ballistic transport to the anode. It is generally assumed that a parallel anode-cathode triode structure would be ideal due to its geometrical compactness and symmetry. In this work, an on-chip integrated flat silicon anode was fabricated to characterize the parallel configuration for well-defined anode-to-emitter distances of $\leq 100~\mu $ m. The observation of NDR in the “triode” operation regime, which is space-charge limited, suggests that the parallel anode-cathode structure will not be ideal for the integration of triodes for some circuit applications because of unfavorable electrostatics in the vacuum channel between the cathode and the anode. In addition, we demonstrated that the performance of the triodes could be engineered to reduce the on-resistance (${R}_{\text {ON}}$ ) and increase the output current by varying the geometry and position of the anode.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.