{"title":"Ferroelectric Assisted Programmable Carrier Stored Layer for Ultralow Turn-Off Loss LIGBTs","authors":"Xiang Wang;Lingyun Zhang;Libin Liu;Xiaobo She;Zhongxin Liang;Jiajia Liao;Lei Xiao;Yichun Zhou;Yufeng Guo;Yu Liu","doi":"10.1109/TED.2025.3558766","DOIUrl":null,"url":null,"abstract":"This work represents the first exploration of ferroelectric HfZrO (HZO) in lateral insulated gate bipolar transistors (LIGBTs), introducing a novel approach to reduce turn-off loss by incorporating a separate ferroelectric control electrode on the carrier stored layer (CSL). Utilizing the unique properties of ferroelectric HZO, such as its non-volatile nature and strong polarization field, the proposed Fe-controlled CSL enables dynamic modulation of carrier concentration in the LIGBT structure. This novel design demonstrates a remarkable 73.6% and 64.9% reduction in turn-off loss (<inline-formula> <tex-math>${E} _{\\text {off}}$ </tex-math></inline-formula>) compared to conventional CSL LIGBT and shorted anode LIGBT, respectively, while maintaining the same <sc>on</small>-state voltage (<inline-formula> <tex-math>${V} _{\\text {on}}$ </tex-math></inline-formula>). Comprehensive characterization of the HZO material confirms its excellent ferroelectric properties, including high remnant polarization, exceptional endurance, and robust data retention capability. Simulation analysis of the carrier concentration distribution reveals the mechanism of Fe-controlled CSL modulation on carrier distribution. This innovative Fe-controlled CSL technology provides a new pathway to overcome the trade-off between conduction and turn-off characteristics in conventional LIGBT devices, paving the way for the development of high-performance power devices with great application prospects in fields requiring high power density integration.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 6","pages":"3058-3062"},"PeriodicalIF":2.9000,"publicationDate":"2025-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10969628/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This work represents the first exploration of ferroelectric HfZrO (HZO) in lateral insulated gate bipolar transistors (LIGBTs), introducing a novel approach to reduce turn-off loss by incorporating a separate ferroelectric control electrode on the carrier stored layer (CSL). Utilizing the unique properties of ferroelectric HZO, such as its non-volatile nature and strong polarization field, the proposed Fe-controlled CSL enables dynamic modulation of carrier concentration in the LIGBT structure. This novel design demonstrates a remarkable 73.6% and 64.9% reduction in turn-off loss (${E} _{\text {off}}$ ) compared to conventional CSL LIGBT and shorted anode LIGBT, respectively, while maintaining the same on-state voltage (${V} _{\text {on}}$ ). Comprehensive characterization of the HZO material confirms its excellent ferroelectric properties, including high remnant polarization, exceptional endurance, and robust data retention capability. Simulation analysis of the carrier concentration distribution reveals the mechanism of Fe-controlled CSL modulation on carrier distribution. This innovative Fe-controlled CSL technology provides a new pathway to overcome the trade-off between conduction and turn-off characteristics in conventional LIGBT devices, paving the way for the development of high-performance power devices with great application prospects in fields requiring high power density integration.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.