Physics-Based Compact Modeling for the Drain Current Variability in Single-Layer Graphene FETs

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Nikolaos Mavredakis;Anibal Pacheco-Sanchez;Ramon Garcia Cortadella;Anton-Guimerà-Brunet;Jose A. Garrido;David Jiménez
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引用次数: 0

Abstract

For the growth of emerging graphene field-effect transistor (GFET) technologies, a thorough characterization of on-wafer variability is required. Here, we report for the first time a physics-based compact model, which precisely describes the drain current ( ${I}_{D}$ ) fluctuations of monolayer GFETs. Physical mechanisms known to generate 1/f noise in transistors, such as carrier number and Coulomb scattering mobility fluctuations, are also revealed to cause ${I}_{D}$ variance. Such effects are considered in the model by being activated locally in the channel and the integration of their contributions from source to drain results in total variance. The proposed model is experimentally validated from a statistical population of three different-sized solution-gated (SG) GFETs from strong p- to strong n-type bias conditions. A series resistance ${I}_{D}$ variance model is also derived mainly contributing at high carrier densities.
基于物理的单层石墨烯场效应管漏极电流变异性紧凑模型
对于新兴的石墨烯场效应晶体管(GFET)技术的发展,需要对晶圆上的可变性进行彻底的表征。在这里,我们首次报道了一个基于物理的紧凑模型,该模型精确地描述了单层gfet的漏极电流(${I}_{D}$)波动。已知在晶体管中产生1/f噪声的物理机制,如载流子数和库仑散射迁移率波动,也揭示了引起${I}_{D}$方差的原因。这种效应在模型中被考虑为在渠道中局部激活,它们从源头到流失的贡献的整合导致了总方差。在强p-到强n型偏置条件下,用三个不同尺寸的溶液门控(SG) gfet的统计种群对所提出的模型进行了实验验证。在高载流子密度下,导出了一个串联电阻${I}_{D}$方差模型。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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