Effective number of accelerated thermal cycles (ATCs) for accurate prediction of damage and fatigue life of solder joints in IGBT power module

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-05-28 DOI:10.1016/j.microrel.2025.115798

Sunday E. Nebo, Emeka H. Amalu, David J. Hughes

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引用次数: 0

Abstract

Insulated gate bipolar transistor (IGBT) power module is vital to efficient functioning of several critical systems in electric vehicle (EV), photovoltaic (PV) module, and more/all electric aircrafts (MEA/AEA). As reliability qualification of IGBT immensely depends on system's modelling which employs thermal cycling, identification of effective number of accelerated thermal cycles (ATCs) is important to ensure accurate reliability prediction. This investigation advises on the effective number of ATCs for modelling damage and fatigue life of 96.5 % tin, 3 % silver, and 0.5 % copper (SAC305) solder joints in IGBT module. SolidWorks software is used to create four realistic 3-D finite element (FE) models of typical IGBT module. The IEC 60068-2-14 thermal cycle test and Anand's time independent visco-plastic constitutive model are implemented in static structural package in ANSYS mechanical software to simulate the response of the models to 6 ATCs, 12 ATCs, 18 ATCs and 24 ATCs. Thirty ATCs produced magnitudes of von-Mises stress, equivalent plastic strain and accumulated strain energy density which are almost invariant with application of greater number of ATC. Deployment of four fatigue life constitutive equations from Morrow, Coffin-Manson, and Syed generated polynomial model which produced minimum and consistent lives of the IGBT modules at about 30 ATCs. Based on this finding, 30 ATCs are proposed as the effective number. The generated models establish the relationship between the number of ATCs and fatigue life predicted for IGBT module. It is proposed to be used to evaluate the effect of number of ATCs employed and the resultant predicted fatigue life of IGBT module.

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加速热循环（ATCs）的有效次数，以准确预测IGBT电源模块中焊点的损伤和疲劳寿命

绝缘栅双极晶体管（IGBT）功率模块对于电动汽车（EV）、光伏（PV）模块和多/全电动飞机（MEA/AEA）中几个关键系统的高效运行至关重要。由于IGBT的可靠性鉴定在很大程度上取决于采用热循环的系统建模，因此识别加速热循环（ATCs）的有效次数对于保证准确的可靠性预测具有重要意义。本研究对IGBT模块中96.5%锡、3%银和0.5%铜（SAC305）焊点的模拟损伤和疲劳寿命的ATCs有效数量提出了建议。利用SolidWorks软件建立了典型IGBT模块的四个逼真的三维有限元模型。在ANSYS机械软件中对静力结构包进行IEC 60068-2-14热循环试验和Anand时间无关的粘塑性本构模型，模拟了模型对6、12、18和24个atc的响应。30个ATC产生的非米塞斯应力、等效塑性应变和累积应变能密度随ATC数量的增加几乎不变。Morrow、Coffin-Manson和Syed的四个疲劳寿命本构方程的部署生成了多项式模型，该模型得出了IGBT模块在大约30 atc时的最小和一致寿命。基于这一发现，提出30个atc作为有效数量。所建立的模型建立了IGBT模块atc数与疲劳寿命预测之间的关系。提出了采用ATCs数量对IGBT模块疲劳寿命影响的评价方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.