Development challenges of a one-sided GaN-based high-current density buck converter through multiphysics optimization for electric vehicle applications

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-05-27 DOI:10.1016/j.microrel.2025.115792

M. Belguith , S. Eloued , M. Kadi , J. Ben Hadj Slama

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引用次数: 0

Abstract

GaN's advantages over conventional semiconductors make it an excellent candidate for deployment in the transportation area. This work aims to develop a simple, one-sided DC/DC GaN-based buck converter for manufacturing and prove its feasibility through multiphysics optimization of the chosen topology. To enhance the design, the Ansys “Q3D tool” is employed to estimate parasitic elements, which are subsequently incorporated into an electrical model in the waveform viewer software “LTspice” to evaluate their impact on the switching node signal “Vsw” of the half bridge structure. Next, we will examine the overshoots and ringings by comparing the measured and simulated converter's Vsw and the output signals. We have implemented robust thermal management in this work. Additionally, this study provides an analysis of current density in the layout and heat distribution in the converter circuit. We will present more precise measurement results that align with the simulation in the primary outcomes, showcasing the effectiveness of the converter layout optimization topology.

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基于单侧氮化镓的高电流密度降压变换器的多物理场优化研究

GaN与传统半导体相比的优势使其成为运输领域部署的绝佳候选者。本研究旨在开发一种简单的单侧DC/DC gan降压变换器，并通过对所选拓扑进行多物理场优化来证明其可行性。为了加强设计，采用Ansys“Q3D工具”对寄生元件进行估计，随后将寄生元件纳入波形查看器软件“LTspice”中的电气模型中，以评估它们对半桥结构交换节点信号“Vsw”的影响。接下来，我们将通过比较测量和模拟的转换器的Vsw和输出信号来检查超调和振铃。我们在这项工作中实现了强大的热管理。此外，本研究还分析了变换器电路布局中的电流密度和热量分布。我们将提供更精确的测量结果，与主要结果中的模拟相一致，展示转换器布局优化拓扑的有效性。

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.