A.E. Elsheikh , M. Ghali , M.M. Mosaad , T. Sharshar
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引用次数: 0
Abstract
In this work, chalcopyrite CuInSe2 (CIS) quantum dots (QDs) with an average size of 3.3 and 7.6 nm as well as CIS nanoparticles (NPs) with an average size of 11.7 nm were synthesized using a hot injection method to study the relationship between particle size and surface defect density. X-ray diffraction (XRD), Raman spectroscopy, transmission electron microscopy (TEM), and UV–Vis spectroscopy were used to characterize the synthesized samples. The UV–Vis absorption spectra reveal that by changing the size of the CIS particles, the band gap energy of the CIS particles can be precisely tuned. Furthermore, the dependence of surface defect density on particle size was explored using positron annihilation spectroscopy (PAS). The measured values of the lifetime component τ2 related to positrons annihilating mainly at the surfaces of the 3.3 and 7.6 nm CIS QDs samples were found to be 428.3 ± 1.0 and 426.3 ± 1.8 ps, respectively. On the other hand, the τ2 value for 11.7 nm CIS NPs is 376.6 ± 1.1 ps. These τ2 values are higher than those of positrons annihilated at vacancy defects in CIS nanocrystals due to the relatively large contribution of positrons annihilated at surface defects of CIS QDs. The results of correlation studies reveal that the dependence of the size and concentration of surface defects on the size of CIS particles is inverse.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.