Tao Wang;Alexander Melnikov;Wenxin Jiang;Tianyan Han;Xiaopu Gu;Yuanjun Guan;Jiayi Wang;Qianchuan Yi;Tianyu Long;Yanqi Zhou;Yichen Zhang;Li Zhang;Binbing Huang;Andreas Mandelis;Lilei Hu
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引用次数: 0
Abstract
Trap states and carrier transport parameters are critical to the performance of p–n-junction-based photodetectors. This study investigates ultrashallow p–n junctions for ultraviolet and low-energy particle detection fabricated using chemical vapor deposition-based pure-boron deposition (CVD-PB) with a junction depth only tens of nanometers, in comparison, also using ion implantation (IMP), epitaxy (EPI), and vacuum evaporation (VEP). Deep-level photothermal spectroscopy (DLPTS) and homodyne photocarrier radiometry (HoPCR) were used to analyze charge carrier dynamics, including charge carrier lifetime and trap states. A phenomenological theoretical model for HoPCR signals was developed to explain trap-state-modulated carrier transport dynamics. CVD-PB junctions demonstrated long recombination lifetimes in the doping layer ($7.09~\pm ~0.01~\mu $ s) and bulk ($35.80~\mu $ s), comparable to high-energy ion-implanted (HE-IMP) junctions ($5.68~\pm ~0.58$ and $36.10~\mu $ s). EPI and VEP junctions have short carrier bulk recombination lifetimes ($1.95~\pm ~0.17$ and $0.63~\pm ~0.03~\mu $ s, respectively). DLPTS revealed an electron trap in the EPI junction with an activation energy of 0.09 eV and a capture cross section of $7.52\times 10^{-{20}}~\pm ~6.82\times 10^{-{21}}$ cm2; no detectable traps were observed in CVD-PB or HE-IMP junctions. Simulations showed that EPI junctions had twice the dark current of CVD-PB and HE-IMP at 10 V, with a 15% reduction in photocurrent. When reversely biased at 5 V and without typical guarding ring designs generally used in optoelectronics, CVD-PB exhibited the lowest dark current ($0.95~\mu $ A/cm${}^{{2}}$ ) when compared to HE-IMP ($3.25~\mu $ A/cm${}^{{2}}$ ) and EPI ($51.77~\mu $ A/cm${}^{{2}}$ ).
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.