{"title":"Single-Event Effects of AlGaN/GaN HEMTs Under Different Biases","authors":"Ling Lv;Changjuan Guo;Muhan Xing;Xuefeng Zheng;Yanrong Cao;Peipei Hu;Jie Liu;Xiaohua Ma;Yue Hao","doi":"10.1109/TED.2025.3550111","DOIUrl":null,"url":null,"abstract":"The single-event effects (SEEs) of AlGaN/GaN HEMT devices under <sc>off</small>-state, semi-<sc>on</small>-state, and <sc>on</small>-state are systematically investigated from experiments and TCAD simulations. Experimental results show that heavy ion radiation causes the most serious damage to the devices under the <sc>off</small>-state. Three regions of nondestructive, leakage degradation, and catastrophic failures induced by SEE are observed as drain-to-source voltage increases. The simulation results show that the peak electric field is largest under the <sc>off</small>-state and the current collection is more significant at high-voltage bias, further confirming the severity of the SEE in the <sc>off</small>-state. It has been shown that high single-event transient currents under the <sc>off</small>-state can cause permanent damage to the device, leading to an increase in device leakage current.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 5","pages":"2467-2473"},"PeriodicalIF":2.9000,"publicationDate":"2025-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10937232/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The single-event effects (SEEs) of AlGaN/GaN HEMT devices under off-state, semi-on-state, and on-state are systematically investigated from experiments and TCAD simulations. Experimental results show that heavy ion radiation causes the most serious damage to the devices under the off-state. Three regions of nondestructive, leakage degradation, and catastrophic failures induced by SEE are observed as drain-to-source voltage increases. The simulation results show that the peak electric field is largest under the off-state and the current collection is more significant at high-voltage bias, further confirming the severity of the SEE in the off-state. It has been shown that high single-event transient currents under the off-state can cause permanent damage to the device, leading to an increase in device leakage current.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.