Muhammad Asif , Altaf Ur Rahman , Gul Rahman , Imed Boukhris , M.S. Al-Buriahi , Zainab Mufarreh Elqahtani
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引用次数: 0
Abstract
First-principles calculations based on density functional theory (DFT) are carried out to study the electronic, structural and optical properties of bulk SnX (X = S, Se). The calculated cohesive energy calculations show that bond strength is smaller in SnSe than SnS that makes SnS energetically more stable than SnSe. Electronic band structures show that, both SnS and SnSe are indirect band gap semiconductors with band gap of 1.09 eV and 0.72 eV, respectively. The BSE method combined with IPA is employed to incorporate excitonic effects, accurately capturing the optical response of the materials. The static dielectric constants of SnS and SnSe exhibit directional anisotropy and show a significant increase when excitonic interactions are considered, highlighting the importance of many-body effects in accurately predicting optical properties. The exciton binding energy and Bohr radius are also calculated to assess the strength of electron–hole interactions. The plasmon frequency is found to be larger for SnS as compared with SnSe due to larger carrier density of SnS. It is shown that SnSe has larger refractive index and extinction coefficient than SnS in both IPA and BSE. Most of the light is absorbed in the visible region for both materials. Both materials have efficient absorption in near infrared (IR) and visible range (VR) and maximum in near ultraviolet (UV) range, but SnSe has a little higher absorption coefficient than SnS in visible spectrum region due to smaller band gap than SnS. Overall, BSE under estimates the optical properties in the UV region as compared with IPA. We, therefore, believe that both materials are efficient for photovoltaic applications.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.