B.D.R. Bonkoungou , R. Gwoziecki , G. Perez , L. Sterna , Z. Khatir
{"title":"Optimized semi-physical EKV model for simulation of SiC MOSFETs","authors":"B.D.R. Bonkoungou , R. Gwoziecki , G. Perez , L. Sterna , Z. Khatir","doi":"10.1016/j.microrel.2025.115780","DOIUrl":null,"url":null,"abstract":"<div><div>This paper presents a detailed static characteristic model based on the EKV (Enz Krummenacher and Vittoz) model for 1200 V SiC MOSFETs in power electronic applications, with a specific focus on <span><math><msub><mi>I</mi><mi>ds</mi></msub><mfenced><msub><mi>V</mi><mi>gs</mi></msub></mfenced></math></span> at different temperatures. The study explores the nuanced behavior parameters in the model and provides a subset of results in this publication. Additionally, the methodology of parameter fitting for the model is elaborated upon, providing insights into the process of refining the model to match real-world behaviors. To validate the steady state characteristics, this paper integrates MOSFET capacitance modeling, internal diode characteristics, and the influence of parasitic elements in the printed circuit board (PCB) for dynamic simulations and comparison with experimental tests conducted. Notably, the model incorporates the physical behavior of the device and can facilitates the integration of drift models for specific parameters, such as threshold voltage <span><math><msub><mi>V</mi><mi>th</mi></msub></math></span>, on state resistance <span><math><msub><mi>R</mi><mrow><mi>ds</mi><mo>,</mo><mi>on</mi></mrow></msub></math></span>. Additionally, with the integration of aging parameters models the current sharing in parallelized devices used in power electronics can be predicted through simulation with the EKV model. This integration can be crucial for establishing models for predictive maintenance of converters equipped with SiC MOSFETs.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"171 ","pages":"Article 115780"},"PeriodicalIF":1.6000,"publicationDate":"2025-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425001933","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents a detailed static characteristic model based on the EKV (Enz Krummenacher and Vittoz) model for 1200 V SiC MOSFETs in power electronic applications, with a specific focus on at different temperatures. The study explores the nuanced behavior parameters in the model and provides a subset of results in this publication. Additionally, the methodology of parameter fitting for the model is elaborated upon, providing insights into the process of refining the model to match real-world behaviors. To validate the steady state characteristics, this paper integrates MOSFET capacitance modeling, internal diode characteristics, and the influence of parasitic elements in the printed circuit board (PCB) for dynamic simulations and comparison with experimental tests conducted. Notably, the model incorporates the physical behavior of the device and can facilitates the integration of drift models for specific parameters, such as threshold voltage , on state resistance . Additionally, with the integration of aging parameters models the current sharing in parallelized devices used in power electronics can be predicted through simulation with the EKV model. This integration can be crucial for establishing models for predictive maintenance of converters equipped with SiC MOSFETs.
本文基于Enz Krummenacher and Vittoz EKV (Enz Krummenacher and Vittoz)模型,给出了电力电子应用中1200 V SiC mosfet的详细静态特性模型,并特别关注了不同温度下的idsvg。该研究探索了模型中细微的行为参数,并在本出版物中提供了结果的子集。此外,还详细阐述了模型的参数拟合方法,提供了对改进模型以匹配现实世界行为的过程的见解。为了验证稳态特性,本文将MOSFET电容建模、内部二极管特性以及寄生元件在印刷电路板(PCB)中的影响进行了动态仿真,并与实验测试进行了比较。值得注意的是,该模型包含了器件的物理行为,可以方便地集成特定参数的漂移模型,如阈值电压Vth、导通状态电阻Rds、导通。此外,通过对老化参数模型的集成,利用EKV模型对电力电子中并行器件的电流共享进行仿真预测。这种集成对于建立配备SiC mosfet的转换器的预测性维护模型至关重要。
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.