Alessandro Sitta, Giuseppe Mauromicale, Michele Fiore, Michele Calabretta
{"title":"Reliability assessment of SiC power MOSFETs in dynamic reverse bias test","authors":"Alessandro Sitta, Giuseppe Mauromicale, Michele Fiore, Michele Calabretta","doi":"10.1016/j.microrel.2025.115770","DOIUrl":null,"url":null,"abstract":"<div><div>Novel reliability tests are being developed for power semiconductor devices, especially for those based on wide band-gap materials, such as silicon carbide (SiC), in electric vehicles field. More specifically, because of the automotive environment and higher permissible slew rates in SiC devices, it is important to assess reliability in harsh conditions. Potentially related to this test, incomplete ionization of the dopants and edge termination fails are reported for SiC devices, in consequence of fast transients, but aging phenomena and parameters drift have not been deeply investigated. The purpose of this work is to evaluate the DRB test in detail, with a reliability perspective.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"171 ","pages":"Article 115770"},"PeriodicalIF":1.6000,"publicationDate":"2025-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425001830","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Novel reliability tests are being developed for power semiconductor devices, especially for those based on wide band-gap materials, such as silicon carbide (SiC), in electric vehicles field. More specifically, because of the automotive environment and higher permissible slew rates in SiC devices, it is important to assess reliability in harsh conditions. Potentially related to this test, incomplete ionization of the dopants and edge termination fails are reported for SiC devices, in consequence of fast transients, but aging phenomena and parameters drift have not been deeply investigated. The purpose of this work is to evaluate the DRB test in detail, with a reliability perspective.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.