Evaluation with FEM analysis of peak case non-rupture current for power devices working at very high current

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
D. Spaggiari , P. Cova , F. Portesine , M. Aschero , N. Delmonte
{"title":"Evaluation with FEM analysis of peak case non-rupture current for power devices working at very high current","authors":"D. Spaggiari ,&nbsp;P. Cova ,&nbsp;F. Portesine ,&nbsp;M. Aschero ,&nbsp;N. Delmonte","doi":"10.1016/j.microrel.2025.115787","DOIUrl":null,"url":null,"abstract":"<div><div>In this work, a Finite Element (FE) thermal model is presented to further understand the mechanism of surge current-induced failure of press-pack devices. The model is set up with the results of electrical measurements and high-framerate video acquisition taken during diode tests to identify the surge current at which the failure occurs. The tests were carried out with an ad hoc bench specifically designed to have surge currents with different energies to be dissipated in the diode under test using the Integral Resonant Sliding Mode Control (IRSMC) technique.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"171 ","pages":"Article 115787"},"PeriodicalIF":1.6000,"publicationDate":"2025-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425002008","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

In this work, a Finite Element (FE) thermal model is presented to further understand the mechanism of surge current-induced failure of press-pack devices. The model is set up with the results of electrical measurements and high-framerate video acquisition taken during diode tests to identify the surge current at which the failure occurs. The tests were carried out with an ad hoc bench specifically designed to have surge currents with different energies to be dissipated in the diode under test using the Integral Resonant Sliding Mode Control (IRSMC) technique.
大电流下电力设备峰值不破裂电流的有限元分析评价
本文提出了一个有限元热模型,以进一步理解冲击电流引起压包器件失效的机理。该模型是根据二极管测试期间的电气测量和高帧率视频采集结果建立的,用于识别发生故障的浪涌电流。测试是在一个特别设计的试验台上进行的,该试验台采用积分谐振滑模控制(IRSMC)技术,使不同能量的浪涌电流在被测二极管中耗散。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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