Power Spectral Density of Thermal Noise at Low Frequencies in Thermal Conductance

IF 2.9 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Electron Devices Pub Date : 2025-03-21 DOI:10.1109/TED.2025.3549738

Kejun Xia

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引用次数: 0

Abstract

We derive the power spectral density (PSD) of thermal flux fluctuation at low frequencies for a thermal conductance

${G}_{\text {th}}$

based on the Green-Kubo relation for thermal conductivity and the heat equation under nonequilibrium conditions. The result is given by

${4}\textit {kT}_{e}^{{2}}{G}_{\text {th}}$

, where k is Boltzmann’s constant, and

${T}_{e}$

, the effective temperature, is shown to depend on the terminal temperatures of the thermal conductor and the temperature coefficient of thermal conductivity. In particular, if the thermal conductor is isothermal at temperature T, the flux fluctuation simplifies to the known

${4}\textit {kT}^{{2}}{G}_{\text {th}}$

. Using a polysilicon resistor as an example, we demonstrate that thermal noise arising from thermal conductance can exceed the noise from electrical conductance under certain conditions, which is driven by the self-heating effect (SHE).

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热传导中低频热噪声的功率谱密度

基于非平衡条件下导热系数Green-Kubo关系和热方程，导出了导热系数${G}_{\text {th}}$的低频热通量波动的功率谱密度（PSD）。结果由${4}\textit {kT}_{e}^{{2}}{G}_{\text {th}}$给出，其中k为玻尔兹曼常数，有效温度${T}_{e}$取决于热导体的终端温度和导热系数。特别地，如果热导体在温度T处是等温的，则通量涨落简化为已知的${4}\ texttit {kT}^{{2}}{G}_{\ text{th}}$。以多晶硅电阻器为例，我们证明了在一定条件下，热传导产生的热噪声可以超过电导产生的噪声，这是由自热效应（SHE）驱动的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Electron Devices 工程技术-工程：电子与电气

CiteScore

5.80

自引率

16.10%

发文量

937

审稿时长

3.8 months

期刊介绍： IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.