{"title":"Effect of 1-MeV Equivalent Neutron Irradiation on the Electrical Characteristic of NiOx/β-Ga2O3 p-n Diode","authors":"Yahui Feng;Hongxia Guo;Wuying Ma;Xiaoping Ouyang;Jinxin Zhang;Fengqi Zhang;Dinghe Liu;Xiaohua Ma;Yue Hao","doi":"10.1109/TED.2025.3554746","DOIUrl":null,"url":null,"abstract":"In this article, the impact of 1-MeV equivalent neutron irradiation on the electronic properties of NiOx/beta-phase gallium oxide (<inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>-Ga2<inline-formula> <tex-math>${\\mathrm {O}}_{{3}}\\text {)}$ </tex-math></inline-formula> p-n diode has been investigated. After neutron irradiation with a fluence of <inline-formula> <tex-math>$1\\times 10^{{14}}$ </tex-math></inline-formula> n/cm2, the forward current density (<inline-formula> <tex-math>${J}_{F}\\text {)}$ </tex-math></inline-formula> decreased by 23%, the leakage current density (<inline-formula> <tex-math>${J}\\text {)}$ </tex-math></inline-formula> was reduced by 45.6%, and the breakdown voltage (<inline-formula> <tex-math>${V}_{\\text {br}}\\text {)}$ </tex-math></inline-formula> increased by approximately 216 V, as measured by current − voltage (I–<inline-formula> <tex-math>${V}\\text {)}$ </tex-math></inline-formula> analysis. The capacitance− voltage (C–<inline-formula> <tex-math>${V}\\text {)}$ </tex-math></inline-formula> measurement shows that the carrier concentration in the lightly doped n-type <inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>-Ga2O3 drift layer decreased from <inline-formula> <tex-math>$1.96\\times 10^{{16}}$ </tex-math></inline-formula> to <inline-formula> <tex-math>$1.74\\times 10^{{16}}$ </tex-math></inline-formula> cm<inline-formula> <tex-math>${}^{-{3}}$ </tex-math></inline-formula> after neutron irradiation. The effect of neutron irradiation on the trap states was studied using frequency-dependent conductivity techniques. It is revealed that the density of trap states at NiOx/<inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>-Ga2O3 increases significantly from 1.12 to <inline-formula> <tex-math>$1.49\\times 10^{{12}}$ </tex-math></inline-formula> cm<inline-formula> <tex-math>${}^{-{2}}\\cdot $ </tex-math></inline-formula>eV<inline-formula> <tex-math>${}^{-{1}}$ </tex-math></inline-formula> to 3.76-<inline-formula> <tex-math>$5.80\\times 10^{{12}}$ </tex-math></inline-formula> cm<inline-formula> <tex-math>${}^{-{2}}\\cdot $ </tex-math></inline-formula>eV<inline-formula> <tex-math>${}^{-{1}}$ </tex-math></inline-formula>, accompanied by a slight decrease in trap activation energy from 0.091 to 0.187 eV to <inline-formula> <tex-math>$0.086-0.185$ </tex-math></inline-formula> eV after neutron irradiation. Additionally, deep-level transient spectroscopy (DLTS) measurements indicate that the trap at an energy level of <inline-formula> <tex-math>${E}_{C}$ </tex-math></inline-formula>–<inline-formula> <tex-math>${E}_{T} =0.75$ </tex-math></inline-formula> eV, induced by neutron irradiation, is likely the primary cause of the degradation in NiOx/<inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>-Ga2O3 p-n diode properties. These findings can offer significant theoretical insights for the design of future anti-radiation hardening.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 5","pages":"2240-2245"},"PeriodicalIF":2.9000,"publicationDate":"2025-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10958189/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this article, the impact of 1-MeV equivalent neutron irradiation on the electronic properties of NiOx/beta-phase gallium oxide ($\beta $ -Ga2${\mathrm {O}}_{{3}}\text {)}$ p-n diode has been investigated. After neutron irradiation with a fluence of $1\times 10^{{14}}$ n/cm2, the forward current density (${J}_{F}\text {)}$ decreased by 23%, the leakage current density (${J}\text {)}$ was reduced by 45.6%, and the breakdown voltage (${V}_{\text {br}}\text {)}$ increased by approximately 216 V, as measured by current − voltage (I–${V}\text {)}$ analysis. The capacitance− voltage (C–${V}\text {)}$ measurement shows that the carrier concentration in the lightly doped n-type $\beta $ -Ga2O3 drift layer decreased from $1.96\times 10^{{16}}$ to $1.74\times 10^{{16}}$ cm${}^{-{3}}$ after neutron irradiation. The effect of neutron irradiation on the trap states was studied using frequency-dependent conductivity techniques. It is revealed that the density of trap states at NiOx/$\beta $ -Ga2O3 increases significantly from 1.12 to $1.49\times 10^{{12}}$ cm${}^{-{2}}\cdot $ eV${}^{-{1}}$ to 3.76-$5.80\times 10^{{12}}$ cm${}^{-{2}}\cdot $ eV${}^{-{1}}$ , accompanied by a slight decrease in trap activation energy from 0.091 to 0.187 eV to $0.086-0.185$ eV after neutron irradiation. Additionally, deep-level transient spectroscopy (DLTS) measurements indicate that the trap at an energy level of ${E}_{C}$ –${E}_{T} =0.75$ eV, induced by neutron irradiation, is likely the primary cause of the degradation in NiOx/$\beta $ -Ga2O3 p-n diode properties. These findings can offer significant theoretical insights for the design of future anti-radiation hardening.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.