The γ-Ray TID Effect and Irradiation Damage Recovery on β-Ga₂O₃/Al₂O₃ MOSCAPs

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Song Li;Mingchao Yang;Leidang Zhou;Liang Chen;Silong Zhang;Fangbao Wang;Zhang Wen;Songquan Yang;Ming Li;Weihao Liu;Li Geng;Yue Hao;Xiaoping Ouyang
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Abstract

In this study, the impact of $\gamma $ -ray total ionizing dose (TID) irradiation on the electrical performance of beta-gallium oxide ( $\beta $ -Ga2O3)/Al2O3 MOSCAPs was investigated, and a new irradiation damage recovery method was also proposed using the supercritical N2O (SCN2O) fluid postoxidation annealing (POA) process. After a cumulative $\gamma $ -ray dose of 1.108 Mrad (SiO2), the net carrier concentration ( ${N} _{\text {d}}$ ) decreased by 28.7%, and the interface state density ( ${D} _{\text {it}}$ ) increased from $4.41\times 10^{{11}}$ to $5.12\times 10^{{11}}$ ${\mathrm {eV}}^{-{1}}$ ${\mathrm {cm}}^{-{2}}$ , according to the frequency-dependent capacitance-voltage (C–V) measurements. Meanwhile, the effective trapped charge density ( ${N} _{\text {eff}}$ ) was reduced from $- 1.82\times 10^{{12}}$ to $- 1.37\times 10^{12}$ ${\mathrm {eV}}^{-{1}}$ ${\mathrm {cm}}^{-{2}}$ , leading to a decreased flat-band voltage ( ${V} _{\text {fb}}$ ), which was attributed to the formation of positively charged oxide trapped charge ( ${N} _{\text {ot}}$ ). What is more, the forward leakage current density increased by ten times, and a 9.5% decrease in the breakdown voltage ( ${V} _{\text {br}}$ ) was observed according to the current-voltage (I–V) measurements. Moreover, the leakage current analysis indicated that the changes in the I–V characteristics were primarily caused by variations in ${D} _{\text {it}}$ and ${N} _{\text {ot}}$ . In addition, after the SCN2O POA process at $120~^{\circ }$ C, the damages of the irradiated device can be repaired. Specifically, the material properties, such as ${N} _{\text {d}}$ , ${D} _{\text {it}}$ , and ${N} _{\text {eff}}$ , and the electrical properties of ${V} _{\text {br}}$ and the forward leakage current density recovered to the preirradiation level. The results demonstrated that the low-temperature SCN2O POA process is promising for repairing TID irradiation damage in $\beta $ -Ga2O3/Al2 ${\mathrm {O}}_{{3}} \cdot $ devices.
γ射线TID对β-Ga₂O₃/Al₂O₃MOSCAPs的影响及辐照损伤恢复
本研究研究了$\gamma $ -射线总电离剂量(TID)辐照对β -氧化镓($\beta $ -Ga2O3)/Al2O3 MOSCAPs电性能的影响,并提出了一种利用超临界N2O (SCN2O)流体氧化后退火(POA)工艺的辐照损伤恢复新方法。在累积$\gamma $射线剂量为1.108 Mrad (SiO2)后,净载流子浓度(${N} _{\text {d}}$)降低了28.7%%, and the interface state density ( ${D} _{\text {it}}$ ) increased from $4.41\times 10^{{11}}$ to $5.12\times 10^{{11}}$ ${\mathrm {eV}}^{-{1}}$ ${\mathrm {cm}}^{-{2}}$ , according to the frequency-dependent capacitance-voltage (C–V) measurements. Meanwhile, the effective trapped charge density ( ${N} _{\text {eff}}$ ) was reduced from $- 1.82\times 10^{{12}}$ to $- 1.37\times 10^{12}$ ${\mathrm {eV}}^{-{1}}$ ${\mathrm {cm}}^{-{2}}$ , leading to a decreased flat-band voltage ( ${V} _{\text {fb}}$ ), which was attributed to the formation of positively charged oxide trapped charge ( ${N} _{\text {ot}}$ ). What is more, the forward leakage current density increased by ten times, and a 9.5% decrease in the breakdown voltage ( ${V} _{\text {br}}$ ) was observed according to the current-voltage (I–V) measurements. Moreover, the leakage current analysis indicated that the changes in the I–V characteristics were primarily caused by variations in ${D} _{\text {it}}$ and ${N} _{\text {ot}}$ . In addition, after the SCN2O POA process at $120~^{\circ }$ C, the damages of the irradiated device can be repaired. Specifically, the material properties, such as ${N} _{\text {d}}$ , ${D} _{\text {it}}$ , and ${N} _{\text {eff}}$ , and the electrical properties of ${V} _{\text {br}}$ and the forward leakage current density recovered to the preirradiation level. The results demonstrated that the low-temperature SCN2O POA process is promising for repairing TID irradiation damage in $\beta $ -Ga2O3/Al2 ${\mathrm {O}}_{{3}} \cdot $ devices.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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