A review in thermal management for advanced chip packaging from chip to heat sink

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-05-12 DOI:10.1016/j.microrel.2025.115782

Minsoo Kim , Jaehyun Kim , Woosung Park , Joon Sang Kang

{"title":"A review in thermal management for advanced chip packaging from chip to heat sink","authors":"Minsoo Kim , Jaehyun Kim , Woosung Park , Joon Sang Kang","doi":"10.1016/j.microrel.2025.115782","DOIUrl":null,"url":null,"abstract":"<div><div>As the architectural complexity of semiconductor devices increases, energy-efficient thermal management in semiconductor packages has become a significant challenge. The effectiveness of thermal management dictates the performance and reliability of semiconductor packaging, making it a crucial factor in the design of high-performance and high-density systems. This review provides a detailed overview of recent advances in thermal management solutions for semiconductor packages, with a particular focus on heat conduction from the chip to the heat sink. The review first introduces advanced thermal characterization techniques, which are essential for evaluating the passive thermal performance of chip packages. It then explores the use of high thermal conductivity materials in various components, such as thermal interface materials (TIMs), heat spreaders, and package substrates, all of which are critical for improving heat dissipation. Additionally, the review examines design aspects aimed at enhancing heat removal rates, including interface engineering between dissimilar components and the incorporation of thermal vias within a package. The aforementioned approaches can be combined to optimize overall thermal performance in semiconductor packages, requiring careful material selection and appropriate thermal engineering design.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"170 ","pages":"Article 115782"},"PeriodicalIF":1.6000,"publicationDate":"2025-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425001957","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

As the architectural complexity of semiconductor devices increases, energy-efficient thermal management in semiconductor packages has become a significant challenge. The effectiveness of thermal management dictates the performance and reliability of semiconductor packaging, making it a crucial factor in the design of high-performance and high-density systems. This review provides a detailed overview of recent advances in thermal management solutions for semiconductor packages, with a particular focus on heat conduction from the chip to the heat sink. The review first introduces advanced thermal characterization techniques, which are essential for evaluating the passive thermal performance of chip packages. It then explores the use of high thermal conductivity materials in various components, such as thermal interface materials (TIMs), heat spreaders, and package substrates, all of which are critical for improving heat dissipation. Additionally, the review examines design aspects aimed at enhancing heat removal rates, including interface engineering between dissimilar components and the incorporation of thermal vias within a package. The aforementioned approaches can be combined to optimize overall thermal performance in semiconductor packages, requiring careful material selection and appropriate thermal engineering design.

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先进芯片封装从芯片到散热器的热管理综述

随着半导体器件结构复杂性的增加，半导体封装中的节能热管理已成为一个重大挑战。热管理的有效性决定了半导体封装的性能和可靠性，使其成为高性能和高密度系统设计的关键因素。这篇综述详细概述了半导体封装热管理解决方案的最新进展，特别关注从芯片到散热器的热传导。本文首先介绍了先进的热表征技术，这对于评估芯片封装的被动热性能至关重要。然后探讨了在各种组件中使用高导热材料，例如热界面材料（TIMs），散热器和封装基板，所有这些都是改善散热的关键。此外，本文还考察了旨在提高散热率的设计方面，包括不同组件之间的界面工程和在封装中加入热通孔。上述方法可以结合起来优化半导体封装的整体热性能，需要仔细选择材料和适当的热工程设计。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.