A Broadband Antenna With Folded Structure and Packaged Solar Cell

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Wenxing An;Chenxi Liu;Kai Han;Yi Wu;Yu Luo
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Abstract

A broadband folded antenna with horizontal and vertical structures is proposed for 2G/3G/4G/5G sub-6-GHz applications. With the packaging process, two solar cells are mounted on the horizontal structure to replace the metallic patch for green communications. Due to the limitation of the regular shape of the solar cell, the existing unidirectional designs have achieved a bandwidth of 60.5% with solar cells for radiation directly. Compared with previous work, this design proposes a folded structure for solar cell antennas to increase the design flexibility. This multiresonant structure with horizontal and vertical parts can stimulate high-order mode to enhance the broadband performance. Furthermore, this folded design can manipulate the current distribution for stable radiation performance. The measured −10-dB band is from 1.7 to 3.85 GHz with a relative bandwidth of 77.4%. Unidirectional patterns are obtained with a peak gain of 5.96 dBi. Solar cells cover 55% of the top area for energy self-sufficiency. With the capacity for photovoltaic power generation, this dual-function device would be a competitive candidate for future low-carbon communications.
一种折叠结构的宽带天线和封装太阳能电池
针对2G/3G/4G/5G sub-6 ghz的应用,提出了一种水平和垂直结构的宽带折叠天线。在包装过程中,两个太阳能电池被安装在水平结构上,以取代绿色通信的金属贴片。由于太阳能电池规则形状的限制,现有的单向设计已经实现了60.5%的带宽与太阳能电池直接辐射。与以往的工作相比,本设计提出了太阳能电池天线的折叠结构,增加了设计的灵活性。这种具有水平和垂直部分的多谐振结构可以激发高阶模式,从而提高宽带性能。此外,这种折叠设计可以控制电流分布,以获得稳定的辐射性能。−10db频段测量范围为1.7 ~ 3.85 GHz,相对带宽为77.4%。单向图的峰值增益为5.96 dBi。太阳能电池占能源自给自足面积的55%。由于具备光伏发电的能力,这种双功能设备将成为未来低碳通信的有竞争力的候选设备。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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