Unified Microwave Terahertz Waveguide Coupler for Multiband Wireless Applications

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-03-31 DOI:10.1109/TCPMT.2025.3556594

Jie Deng;Pascal Burasa;Ke Wu

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引用次数: 0

Abstract

In this work, a microwave (MW) and terahertz (THz) composite waveguide coupler for multiband wireless systems is proposed and demonstrated. Such a very large frequency ratio (more than

$20\times $

) of the proposed coupler is made possible thanks to a composite waveguide technique where the center strip of a coplanar waveguide (CPW) is replaced by a substrate-integrated waveguide (SIW) block. In this way, the dual-mode operation, i.e., quasi-TEM mode and TE₁₀ mode, can be enabled simultaneously at different frequencies. In addition, by adjusting the SIW width, the operating frequency of the quasi-TEM mode and the TE₁₀ mode can be reassigned. All the advantages known for CPW couplers and SIW couplers are inherited in the proposed waveguide coupler. To validate this scheme, experimental prototypes are developed and fabricated on a thin-film miniature hybrid MW-integrated circuit (MHMIC) process. Measured results confirm the good THz performance as well as MW performance.

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用于多波段无线应用的统一微波太赫兹波导耦合器

在这项工作中，提出并演示了一种用于多波段无线系统的微波（MW）和太赫兹（THz）复合波导耦合器。这种非常大的频率比（超过$20\times $）是由于复合波导技术，其中共面波导（CPW）的中心带被基板集成波导（SIW）块取代。这样可以在不同频率同时开启准tem模式和TE10模式双模式工作。此外，通过调整SIW宽度，准tem模式和TE10模式的工作频率可以重新分配。该波导耦合器继承了CPW和SIW耦合器的所有优点。为了验证该方案，在薄膜微型混合毫瓦集成电路（MHMIC）工艺上开发并制作了实验样机。测量结果证实了该器件具有良好的太赫兹性能和毫瓦性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.