A Simplified Radiation Model for Amplitude-Only Near-Field Reconstruction of Multiple Sources on Package Interconnects

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Wei-Jen Chen;Wei-Kai Chen;Ming-Chung Huang;Ruey-Beei Wu
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引用次数: 0

Abstract

This study proposes a novel modal decomposition method to allow reconstructing principal components of radiation sources in multi-interconnect systems from the amplitude-only near magnetic field measurement. Singular value decomposition (SVD) is used to express any radiation field as a linear combination of modes of multiple coupled interconnects. The same method is used for arbitrary dipole distribution. A suitable noise model is determined using only a few principal modes, rather than a large quantity of dipoles. For amplitude-only field data, the dipole model is solved by determining the coefficients of modes using a pattern search optimization, which is a relatively simple and time-saving algorithm. The proposed method is validated using a numerical example of multi-interconnect radiation. The field that is reconstructed using the proposed model exhibits a high degree of consistency with the actual spatial fields in terms of field amplitude and phase. Thence, the de-sense issues of the multi-interconnect systems can be effectively determined by the superposition of the effects from a few principal modes.
封装互连多源仅幅近场重建的简化辐射模型
本文提出了一种新的模态分解方法,可以从仅限幅值的近磁场测量中重构多互连系统中辐射源的主成分。利用奇异值分解(SVD)将任意辐射场表示为多个耦合互连模式的线性组合。同样的方法也适用于任意偶极子分布。一个合适的噪声模型是只用几个主模来确定的,而不是用大量的偶极子。对于仅振幅场数据,偶极子模型的求解方法是利用模式搜索优化算法确定模式系数,这是一种相对简单和省时的算法。通过多互连辐射的数值算例验证了该方法的有效性。利用该模型重建的场在场振幅和场相位方面与实际空间场具有高度的一致性。因此,可以通过叠加几个主模的效应来有效地确定多互连系统的脱义问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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