Victor Ralchenko , Andrey Bolshakov , Dmitry Sovyk , Vladimir Artemov , Alexander Vasiliev , Yury Krylov , Artem Martyanov , Irina Fedorova , Vladimir Masalov , Alexey Popovich , Bing Dai , Jiaqi Zhu
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引用次数: 0
Abstract
Synthesis of diamond layers with reduced dislocation density is vital for diamond application in electronics and photonics. The method of epitaxial lateral growth (ELO) based on blocking the dislocations propagation by a patterned mask on the substrate, is promising to control the dislocations. Here, we demonstrate the epitaxial diamond growth using a novel type of the mask for diamond ELO, consisting of a few monolayers thick self-assembled periodic lattice of submicron SiO2 spheres (opal structure). The method is simple, and does not require a lithography technique for the pattern definition. The porous opal mask with SiO2 spheres of ≈240 nm diameter was deposited on HPHT diamond substrates, then the epitaxial film was grown from bottom by microwave plasma CVD in a CH4-H2-O2 gas mixture. After penetration through the void system, a continuous smooth diamond film formed on the surface of the opal layer. High resolution transmission electron microscopy (HRTEM), electron diffraction and electron back scattering diffraction unambiguously indicated the single crystal structure of the formed diamond film, which were analyzed also with Raman and photoluminescence spectroscopy. The realized ELO version is promising for growth of low-defect single crystal diamond material, provided a further improvement of the opal mask colloidal templating.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.