D. Surya Reddy , V. Rajagopal Reddy , Chel-Jong Choi
{"title":"Gaussian distribution on electrical properties of identically fabricated Au/n-GaN Schottky junctions with a Nd2O3 interfacial layer","authors":"D. Surya Reddy , V. Rajagopal Reddy , Chel-Jong Choi","doi":"10.1016/j.mssp.2025.109650","DOIUrl":null,"url":null,"abstract":"<div><div>This work emphasizes the twenty Au/Nd<sub>2</sub>O<sub>3</sub>/n-GaN MIS junctions identically fabricated using the e-beam evaporation technique. The electrical and interfacial properties of the identically prepared MIS junctions were investigated using current-voltage (I-V) measurements. The surface topology and chemical properties of the Nd<sub>2</sub>O<sub>3</sub> film on the n-GaN were investigated using AFM and XPS techniques. The barrier height (Φ<sub>b</sub>) and the ideality factor (n) of the twenty MIS junctions were estimated, revealing variability across different junctions. Using statistical analysis, the mean values of rectification ratio (RR), barrier height (Φ<sub>b</sub>), ideality factor (n), series resistance (R<sub>S</sub>) and shunt resistance (R<sub>Sh</sub>) were estimated from I-V data based on thermionic emission (TE) theory. The fluctuations in the electrical parameters are attributed to an inhomogeneous interfacial layer and barrier height, as well as the non-uniformity of interfacial traps, dislocations and grain boundaries. The laterally homogeneous Φ<sub>b</sub> was also estimated for the twenty MIS junctions from the linear association between the experimental n and Φ<sub>b</sub>. The lateral inhomogeneity of Φ<sub>b</sub> was clarified by examining the correlation between n and Φ<sub>b</sub> of the identically prepared MIS junctions. Further, the mean interface state density (N<sub>SS</sub>) was determined for the MIS junctions.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"196 ","pages":"Article 109650"},"PeriodicalIF":4.2000,"publicationDate":"2025-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science in Semiconductor Processing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369800125003877","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This work emphasizes the twenty Au/Nd2O3/n-GaN MIS junctions identically fabricated using the e-beam evaporation technique. The electrical and interfacial properties of the identically prepared MIS junctions were investigated using current-voltage (I-V) measurements. The surface topology and chemical properties of the Nd2O3 film on the n-GaN were investigated using AFM and XPS techniques. The barrier height (Φb) and the ideality factor (n) of the twenty MIS junctions were estimated, revealing variability across different junctions. Using statistical analysis, the mean values of rectification ratio (RR), barrier height (Φb), ideality factor (n), series resistance (RS) and shunt resistance (RSh) were estimated from I-V data based on thermionic emission (TE) theory. The fluctuations in the electrical parameters are attributed to an inhomogeneous interfacial layer and barrier height, as well as the non-uniformity of interfacial traps, dislocations and grain boundaries. The laterally homogeneous Φb was also estimated for the twenty MIS junctions from the linear association between the experimental n and Φb. The lateral inhomogeneity of Φb was clarified by examining the correlation between n and Φb of the identically prepared MIS junctions. Further, the mean interface state density (NSS) was determined for the MIS junctions.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.