{"title":"100 Gbit/s and Beyond IEEE 802.15.3d Channelization Compatible THz Communications Enabled by a Broadband MUTC Photodiode","authors":"Ezgi Abacıoğlu;Abdu Subahan Mohammed;Jonas Tebart;Marcel Grzeslo;Tom Neerfeld;José Luis Fernández Estévez;Pascal Szriftgiser;Guillaume Ducournau;Andreas Stöhr","doi":"10.1109/TTHZ.2025.3541824","DOIUrl":null,"url":null,"abstract":"We present photonics-driven high data rate IEEE 802.15.3d compliant terahertz (THz) communication links operated at a center frequency of 280 GHz. We analyze wireless data transmission within selected single and dual channels of the IEEE 802.15.3d and assess the outcomes through additional back-to-back (B2B) data transmission measurements and calibrated link budgets of the THz link. The system architecture uses on-wafer probing of a single high-power and highly linear broadband modified unitraveling-carrier photodiode (MUTC-PD). Using the MUTC-PD as THz transmitter, we report 16-QAM 100 Gbit/s 25-cm wireless links for single and dual channel data transmission with significantly low error vector magnitude (EVM) levels, that is, 12.3% and 10.9%, respectively. As for B2B demonstration, we successfully transmit 200 Gbit/s (32-QAM) in a single channel with 7.5% EVM and 160 Gbit/s (16-QAM) in dual channel with 7.8% EVM. We further display the highly linear nature of the MUTC-PD by efficient data transmission with higher modulation formats, which is also supported by the power-saturation characteristics of the PD. To the best of the authors´ knowledge, this is the first study investigating the IEEE 802.15.3d channelization compliancy through system level design and spectral verification while at the same time achieving 100 Gbit/s and beyond data rates with notably low EVM values.","PeriodicalId":13258,"journal":{"name":"IEEE Transactions on Terahertz Science and Technology","volume":"15 3","pages":"389-399"},"PeriodicalIF":3.9000,"publicationDate":"2025-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10884861","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Terahertz Science and Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10884861/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
We present photonics-driven high data rate IEEE 802.15.3d compliant terahertz (THz) communication links operated at a center frequency of 280 GHz. We analyze wireless data transmission within selected single and dual channels of the IEEE 802.15.3d and assess the outcomes through additional back-to-back (B2B) data transmission measurements and calibrated link budgets of the THz link. The system architecture uses on-wafer probing of a single high-power and highly linear broadband modified unitraveling-carrier photodiode (MUTC-PD). Using the MUTC-PD as THz transmitter, we report 16-QAM 100 Gbit/s 25-cm wireless links for single and dual channel data transmission with significantly low error vector magnitude (EVM) levels, that is, 12.3% and 10.9%, respectively. As for B2B demonstration, we successfully transmit 200 Gbit/s (32-QAM) in a single channel with 7.5% EVM and 160 Gbit/s (16-QAM) in dual channel with 7.8% EVM. We further display the highly linear nature of the MUTC-PD by efficient data transmission with higher modulation formats, which is also supported by the power-saturation characteristics of the PD. To the best of the authors´ knowledge, this is the first study investigating the IEEE 802.15.3d channelization compliancy through system level design and spectral verification while at the same time achieving 100 Gbit/s and beyond data rates with notably low EVM values.
期刊介绍:
IEEE Transactions on Terahertz Science and Technology focuses on original research on Terahertz theory, techniques, and applications as they relate to components, devices, circuits, and systems involving the generation, transmission, and detection of Terahertz waves.