{"title":"DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate","authors":"Thomas Pallaro , Tristan Dubois , Magali De Matos , Christophe Chang , Nathalie Labat , Benoit Lambert , Nathalie Malbert","doi":"10.1016/j.microrel.2025.115772","DOIUrl":null,"url":null,"abstract":"<div><div>This article focuses on the comprehensive evaluation of performance and robustness in microwave AlGaN/GaN HEMTs. The study investigates whether the degradation mechanisms observed during DC aging test align with those observed during RF aging test. A time-domain load-pull setup (1.8 GHz – 18 GHz) is utilized to measure key parameters during RF stresses and characterize the devices, highlighting key differences in degradation mechanisms between RF and DC aging tests. These findings shed light on the behavior of HEMTs when subjected to a RF signal, emphasizing the necessity of comprehensive analysis for ensuring device reliability in practical scenarios.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"170 ","pages":"Article 115772"},"PeriodicalIF":1.6000,"publicationDate":"2025-05-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425001854","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This article focuses on the comprehensive evaluation of performance and robustness in microwave AlGaN/GaN HEMTs. The study investigates whether the degradation mechanisms observed during DC aging test align with those observed during RF aging test. A time-domain load-pull setup (1.8 GHz – 18 GHz) is utilized to measure key parameters during RF stresses and characterize the devices, highlighting key differences in degradation mechanisms between RF and DC aging tests. These findings shed light on the behavior of HEMTs when subjected to a RF signal, emphasizing the necessity of comprehensive analysis for ensuring device reliability in practical scenarios.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.