A Comparative Study of Semiconductor Virtual Metrology Methods and Novel Algorithmic Framework for Dynamic Sampling

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Xu Han;Marcella Miller;James Moyne;Gregory William Vogl;Anita Penkova;Xiaodong Jia
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引用次数: 0

Abstract

Virtual metrology (VM) is an important technology in semiconductor manufacturing that enhances process control, reduces costs, and improves quality. However, as processes become more complicated and process variations increase due to high-mix manufacturing, VM still faces challenges such as sensor drift and shift, as well as limited availability of metrology data due to high costs. This paper proposes an online Gaussian process (OGP) model designed to operate effectively with minimal initial metrology data and adapt dynamically to new data. The OGP model incorporates uncertainty quantification to optimize the sampling process, thereby enabling an adaptive sampling strategy to conduct metrology based on the process control needs. The proposed method is validated using a public dataset from the chemical mechanical planarization (CMP) process, demonstrating its effectiveness in tracking data drift and shift while reducing the required metrology data to retain model performance in an online operation setting.
半导体虚拟计量方法与动态采样新算法框架的比较研究
虚拟计量(VM)是半导体制造领域的一项重要技术,它可以增强过程控制,降低成本,提高质量。然而,随着工艺变得越来越复杂,工艺变化由于高混合制造而增加,VM仍然面临着诸如传感器漂移和移位等挑战,以及由于高成本而导致计量数据可用性有限。本文提出了一种在线高斯过程(OGP)模型,该模型可以在最小的初始计量数据下有效地运行,并动态地适应新数据。OGP模型结合了不确定性量化来优化采样过程,从而使自适应采样策略能够根据过程控制需求进行计量。利用化学机械平化(CMP)过程的公共数据集验证了所提出的方法,证明了其在跟踪数据漂移和移位方面的有效性,同时减少了在在线操作设置中保持模型性能所需的计量数据。
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来源期刊
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing 工程技术-工程:电子与电气
CiteScore
5.20
自引率
11.10%
发文量
101
审稿时长
3.3 months
期刊介绍: The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.
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