Eugene Chubenko, Sergey Maximov, Cong Doan Bui, Victor Borisenko
{"title":"Optical properties of carbon nitride thin films fabricated by rapid chemical vapor deposition","authors":"Eugene Chubenko, Sergey Maximov, Cong Doan Bui, Victor Borisenko","doi":"10.1016/j.mssp.2025.109617","DOIUrl":null,"url":null,"abstract":"<div><div>Developed rapid chemical vapor deposition lasting only 3 min allowed to produce smooth layered carbon nitride polycrystalline thin films as thick as 830–1547 nm at 550–625 °C in air with crystallites in the layers oriented parallel to the substrate (glass or silicon) surface. They are distinguished by high transparency in the visible range and the thickness uniformity. It made possible an adequate optical transmission and absorption spectra measurements at room temperature and their correct processing with the Swanepoel's envelope method to determine optical properties of the films and compare them with characteristics of carbon nitride materials obtained by conventional chemical vapor deposition or thermal polymerization. The application of the Swanepoel's method allowed to determine actual thickness of the films and then the refraction index of the material to be 2.50–3.25 and the extinction coefficient to be 0.1–0.4 as functions of the deposition temperature. The average photoluminescence lifetime of the deposited material is found to be 2.3–2.6 ns for high energy carrier recombination processes being the shortest in the sample fabricated at 550 °C and correlating with crystallinity of the film. Optimal temperature for rapid chemical vapor deposition of carbon nitride thin films is concluded to be in the range of 550–575 °C providing its best properties promising for electronic and optoelectronic applications.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"195 ","pages":"Article 109617"},"PeriodicalIF":4.2000,"publicationDate":"2025-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science in Semiconductor Processing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369800125003543","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Developed rapid chemical vapor deposition lasting only 3 min allowed to produce smooth layered carbon nitride polycrystalline thin films as thick as 830–1547 nm at 550–625 °C in air with crystallites in the layers oriented parallel to the substrate (glass or silicon) surface. They are distinguished by high transparency in the visible range and the thickness uniformity. It made possible an adequate optical transmission and absorption spectra measurements at room temperature and their correct processing with the Swanepoel's envelope method to determine optical properties of the films and compare them with characteristics of carbon nitride materials obtained by conventional chemical vapor deposition or thermal polymerization. The application of the Swanepoel's method allowed to determine actual thickness of the films and then the refraction index of the material to be 2.50–3.25 and the extinction coefficient to be 0.1–0.4 as functions of the deposition temperature. The average photoluminescence lifetime of the deposited material is found to be 2.3–2.6 ns for high energy carrier recombination processes being the shortest in the sample fabricated at 550 °C and correlating with crystallinity of the film. Optimal temperature for rapid chemical vapor deposition of carbon nitride thin films is concluded to be in the range of 550–575 °C providing its best properties promising for electronic and optoelectronic applications.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.