ML-Driven Compact Models for RRAMs: Addressing Variability and Simulation Efficiency

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Giyong Hong;In Huh;Joo Hyung You;Jae Myung Choe;Younggu Kim;Changwook Jeong
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引用次数: 0

Abstract

Machine Learning (ML)-based compact modeling provides a promising alternative to traditional physics-based methods, enabling faster development of compact models for novel devices while offering improved predictive performance. For Resistive Random Access Memory (RRAM) devices, several ML-based compact models have been developed. However, these models often face two key challenges: they fail to capture stochastic cycle-to-cycle variations effectively, and they are difficult to accurately convert into Verilog-A models for SPICE simulations. To address these challenges, we propose a novel variation-aware ML-based compact model for RRAM, using modified deep ensemble techniques to account for cycle-to-cycle variations and model uncertainty, along with a newly designed state determination function to accurately capture resistive switching characteristics. Furthermore, by introducing knowledge distillation combined with a pruning-retraining process, the proposed model achieves a 67% reduction in simulation turnaround time while maintaining predictive accuracy, ensuring strong compatibility with SPICE simulations.
机器学习驱动的rram紧凑模型:寻址可变性和仿真效率
基于机器学习(ML)的紧凑型建模为传统的基于物理的方法提供了一种有前途的替代方案,可以更快地开发新型设备的紧凑型模型,同时提供改进的预测性能。对于电阻随机存取存储器(RRAM)器件,已经开发了几种基于ml的紧凑模型。然而,这些模型经常面临两个关键挑战:它们无法有效地捕获随机周期到周期的变化,并且它们难以准确地转换为SPICE模拟的Verilog-A模型。为了解决这些挑战,我们提出了一种新的变化感知的基于ml的RRAM紧凑模型,使用改进的深度集成技术来考虑周期间的变化和模型不确定性,以及新设计的状态确定函数来准确捕获电阻开关特性。此外,通过引入知识蒸馏与修剪-再训练过程相结合,所提出的模型在保持预测准确性的同时,将模拟周转时间减少了67%,确保了与SPICE模拟的强兼容性。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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