Bit Line Hammering in Si-Based VCT DRAM: A New Security Challenge and Its Mitigation

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yong Liu;Da Wang;Pengpeng Ren;Runsheng Wang;Zhigang Ji;Ru Huang
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引用次数: 0

Abstract

We introduce the Bit Line Hammer (BL hammer) effect, a serious disturbance mechanism in 4F2 DRAM with Si-based Vertical Channel Transistors (VCT). We demonstrate that a specifically designed BL attack pattern, featuring asymmetry and an appropriate toggling frequency, can trigger numerous bit-flips under JEDEC standards, especially at elevated temperatures. This uncovers an unexplored security vulnerability in VCT DRAM cells, with implications for data integrity in advanced memory technologies. Finally, we propose a mitigation strategy to improve cell’s resistance to the BL hammering.
si基VCT DRAM中的位线锤击:一种新的安全挑战及解决方法
介绍了位线锤效应,这是硅基垂直通道晶体管(VCT) 4F2 DRAM中的一种严重干扰机制。我们证明了一个专门设计的BL攻击模式,具有不对称和适当的切换频率,可以在JEDEC标准下触发大量的位翻转,特别是在高温下。这揭示了VCT DRAM单元中一个未被探索的安全漏洞,对高级存储技术中的数据完整性有影响。最后,我们提出了一种缓解策略来提高细胞对BL锤击的抵抗力。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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