Room Temperature Polymer-Based Hybrid Bonding Scheme for 3D Integration and Advanced Packaging

IF 4.1 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Electron Device Letters Pub Date : 2025-02-25 DOI:10.1109/LED.2025.3545557

Yuan-Chiu Huang;Yu-Xian Lin;Chien-Kang Hsiung;Kuan-Neng Chen

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Abstract

This study presents a room-temperature polymer-based hybrid bonding scheme, designed to address the limitations of conventional high-temperature bonding methods in three-dimensional (3D) integration. By performing bonding at room temperature followed by a post-annealing process, the bonding method achieves excellent and reliable bonding results with minimal thermal impact, as it avoids the higher temperature requirements common in conventional polymer-based hybrid bonding, which is advantageous for temperature-sensitive components. SEM and shear test results demonstrate outstanding bonding quality and bonding interface, achieving a bonding strength of 55.58 kgf/cm2. The electrical properties demonstrate stable performance across 1000 cycles of thermal cycling tests (TCT). The proposed room temperature polymer-based hybrid bonding scheme thus provides a viable alternative to conventional dielectric bonding methods, addressing critical challenges in the potential of room-temperature polymer-based hybrid bonding for three-dimensional integration applications.

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三维集成和先进封装的室温聚合物杂化键合方案

本研究提出了一种基于室温聚合物的杂化键合方案，旨在解决传统高温键合方法在三维（3D）集成中的局限性。通过在室温下进行粘合，然后进行后退火工艺，该粘合方法在最小的热影响下获得了优异可靠的粘合结果，因为它避免了传统聚合物基杂化粘合中常见的更高温度要求，这对温度敏感的组件是有利的。SEM和剪切试验结果表明，粘结质量和粘结界面良好，粘结强度达到55.58 kgf/cm2。电气性能在1000次热循环测试（TCT）中表现出稳定的性能。因此，所提出的室温聚合物杂化键合方案为传统的介电键合方法提供了一种可行的替代方案，解决了室温聚合物杂化键合在三维集成应用中潜力的关键挑战。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Electron Device Letters 工程技术-工程：电子与电气

CiteScore

8.20

自引率

10.20%

发文量

551

审稿时长

1.4 months

期刊介绍： IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.