Linear Fine-Tuning VFB and Improved Interface via Novel Al₂O₃ Atomic in-situ Dipole Buffer Layer (DBL) in ALD La₂O₃ Dipole-First Stack

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yanzhao Wei;Jiaxin Yao;Yu Wang;Qingzhu Zhang;Jianfeng Gao;Xiaolei Wang;Jun Luo;Huaxiang Yin
{"title":"Linear Fine-Tuning VFB and Improved Interface via Novel Al₂O₃ Atomic in-situ Dipole Buffer Layer (DBL) in ALD La₂O₃ Dipole-First Stack","authors":"Yanzhao Wei;Jiaxin Yao;Yu Wang;Qingzhu Zhang;Jianfeng Gao;Xiaolei Wang;Jun Luo;Huaxiang Yin","doi":"10.1109/LED.2025.3549003","DOIUrl":null,"url":null,"abstract":"In this letter, a novel Al2O3 atomic in-situ dipole buffer layer (DBL) technique is proposed for achieving VFB linear fine-tunability and interface improvement in La2O3 dipole-first gate stack. 10 VFB levels with minimum 9 mV linear fine-tuning step in 400 mV range are achieved by manipulating sub-5-Å Al2O3 between SiO2 interfacial layer (IL) and La2O3 dipole layer in metal-oxide-semiconductor capacitors (MOSCAPs). Furthermore, the Si/SiO2 interface is improved with more than 60.3% interface trap density (Dit) decrease by suppressing La-Si interdiffusion with Al-DBL. A mechanism of La-dipole fine-tuning is proposed and indicates that the Al-DBL is one of the promising techniques for multi-VT integration in future NS GAA-FETs.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"46 5","pages":"825-828"},"PeriodicalIF":4.1000,"publicationDate":"2025-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10916698/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

In this letter, a novel Al2O3 atomic in-situ dipole buffer layer (DBL) technique is proposed for achieving VFB linear fine-tunability and interface improvement in La2O3 dipole-first gate stack. 10 VFB levels with minimum 9 mV linear fine-tuning step in 400 mV range are achieved by manipulating sub-5-Å Al2O3 between SiO2 interfacial layer (IL) and La2O3 dipole layer in metal-oxide-semiconductor capacitors (MOSCAPs). Furthermore, the Si/SiO2 interface is improved with more than 60.3% interface trap density (Dit) decrease by suppressing La-Si interdiffusion with Al-DBL. A mechanism of La-dipole fine-tuning is proposed and indicates that the Al-DBL is one of the promising techniques for multi-VT integration in future NS GAA-FETs.
ALD La₂O₃偶极子优先叠加中新型Al₂O₃原子原位偶极子缓冲层(DBL)的线性微调VFB和改进界面
本文提出了一种新的Al2O3原子原位偶极子缓冲层(DBL)技术,用于实现La2O3偶极子优先栅极堆叠的VFB线性微调和界面改善。通过操纵金属氧化物半导体电容器(MOSCAPs)中SiO2界面层(IL)和La2O3偶极子层之间的亚5-Å Al2O3,实现了400 mV范围内最小9 mV线性微调步进的10个VFB电平。通过抑制Al-DBL与La-Si的相互扩散,Si/SiO2界面的界面陷阱密度(Dit)降低了60.3%以上。提出了喇偶极子微调的机制,并指出Al-DBL是未来NS gaa场效应管多vt集成的有前途的技术之一。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信