Solder mask as a reliable insulation layer on printed circuit boards–different layouts and materials under humidity and high voltage

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-04-22 DOI:10.1016/j.microrel.2025.115743

M. Vogt , A. Brunko , M.R. Meier , H. Schweigart , L. Henneken , M. Schleicher , D. Schucht , N. Kaminski

引用次数: 0

Abstract

After decades of improvement, the reliability of Printed Circuit Boards (PCB) is well known and standardized. However, the standards are based on outdated material properties and old experiments and thus, they contain a large safety margin, when modern insulation materials are applied. This work focuses on the insulation properties and the reliability of solder mask under high humidity and high voltages. It has been demonstrated that significantly more robust systems can be achieved than the standards specify. This leads the way for further volume reductions.

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阻焊板作为印刷电路板上可靠的绝缘层-在潮湿和高压下，不同的布局和材料

经过几十年的改进，印刷电路板（PCB）的可靠性是众所周知的和标准化的。然而，这些标准是基于过时的材料特性和旧的实验，因此，当应用现代绝缘材料时，它们包含很大的安全余量。本文主要研究了阻焊板在高湿高压条件下的绝缘性能和可靠性。事实证明，可以实现比标准规定的更健壮的系统。这为进一步减少体积开辟了道路。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.