M. Fregolent , F. Bergamin , D. Favero , C. De Santi , Andrea Cester , C. Huber , G. Meneghesso , E. Zanoni , M. Meneghini
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引用次数: 0
Abstract
In this paper we analyze the OFF-state performance of vertical GaN-on-Si Trench MOSFETs in terms of breakdown voltage and stability of the threshold voltage. We proved that the devices fail in OFF-state due to the breakdown of the unprotected gate oxide. Then, by means of a series of fast VTH transient experiments, we demonstrate that the OFF-state threshold voltage instability is given by the trapping of electrons at deep levels in the p-GaN body layer, transported by the rather high drain current leakage. The interpretation was supported by deep level spectroscopy measurements, carried out on p-n junctions located on the same wafer.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.