AI-Assisted Design of Drain-Extended FinFET With Stepped Field Plate for Multi-Purpose Applications

IF 2 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Xiaoyun Huang;Hongyu Tang;Chenggang Xu;Yuxuan Zhu;Yan Pan;Dawei Gao;Yitao Ma;Kai Xu
{"title":"AI-Assisted Design of Drain-Extended FinFET With Stepped Field Plate for Multi-Purpose Applications","authors":"Xiaoyun Huang;Hongyu Tang;Chenggang Xu;Yuxuan Zhu;Yan Pan;Dawei Gao;Yitao Ma;Kai Xu","doi":"10.1109/JEDS.2025.3555327","DOIUrl":null,"url":null,"abstract":"Fin Field-Effect-Transistor (FinFET) has become fundamental components in advanced integrated circuit, while the drain-extended FinFET (DE-FinFET) features a lightly doped drain extension region to improve the device’s breakdown voltage. However, both structural refinement and the optimal integration of various parameters remain limited in achieving comprehensive optimization of device performance. This study introduces a novel DE-FinFET featuring a stepped field plate to improve overall performance of device. Moreover, within an AI-assisted design framework, predictive modeling and multi-objective optimization of the device are accomplished using Kolmogorov–Arnold Networks (KAN) and the Nondominated Sorting Genetic Algorithm (NSGA-III). More importantly, the proposed framework enables efficient device design and performance evaluation, achieving an average prediction accuracy of 98.19% for electrical performance metrics while being over two million times faster than traditional Technology Computer-Aided-Design (TCAD) simulations. In addition, it effectively generates Pareto-optimal solutions, delivering an average improvement of 9.03% across key electrical performance metrics. The proposed novel device of DE-FinFET offers a new route toward tailoring electrical properties. Meanwhile, the methodology of AI-assisted design not only accelerates device design but also enables customizable solutions for multi-purpose applications.","PeriodicalId":13210,"journal":{"name":"IEEE Journal of the Electron Devices Society","volume":"13 ","pages":"326-333"},"PeriodicalIF":2.0000,"publicationDate":"2025-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10943177","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal of the Electron Devices Society","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10943177/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

Fin Field-Effect-Transistor (FinFET) has become fundamental components in advanced integrated circuit, while the drain-extended FinFET (DE-FinFET) features a lightly doped drain extension region to improve the device’s breakdown voltage. However, both structural refinement and the optimal integration of various parameters remain limited in achieving comprehensive optimization of device performance. This study introduces a novel DE-FinFET featuring a stepped field plate to improve overall performance of device. Moreover, within an AI-assisted design framework, predictive modeling and multi-objective optimization of the device are accomplished using Kolmogorov–Arnold Networks (KAN) and the Nondominated Sorting Genetic Algorithm (NSGA-III). More importantly, the proposed framework enables efficient device design and performance evaluation, achieving an average prediction accuracy of 98.19% for electrical performance metrics while being over two million times faster than traditional Technology Computer-Aided-Design (TCAD) simulations. In addition, it effectively generates Pareto-optimal solutions, delivering an average improvement of 9.03% across key electrical performance metrics. The proposed novel device of DE-FinFET offers a new route toward tailoring electrical properties. Meanwhile, the methodology of AI-assisted design not only accelerates device design but also enables customizable solutions for multi-purpose applications.
多用途阶梯场极板漏极扩展FinFET的ai辅助设计
翅片场效应晶体管(FinFET)已成为先进集成电路的基础元件,而漏极扩展FinFET (DE-FinFET)具有轻掺杂的漏极扩展区域,以提高器件的击穿电压。然而,在实现器件性能的全面优化方面,无论是结构的细化还是各参数的优化集成都是有限的。为了提高器件的整体性能,本研究介绍了一种采用阶梯场极板的新型DE-FinFET。此外,在人工智能辅助设计框架内,使用Kolmogorov-Arnold网络(KAN)和非支配排序遗传算法(NSGA-III)完成了设备的预测建模和多目标优化。更重要的是,所提出的框架能够实现高效的器件设计和性能评估,电气性能指标的平均预测精度达到98.19%,同时比传统的技术计算机辅助设计(TCAD)模拟快200多万倍。此外,它有效地生成了帕累托最优解决方案,在关键电气性能指标上平均提高了9.03%。提出的新型DE-FinFET器件为定制电性能提供了一条新的途径。同时,人工智能辅助设计的方法不仅加速了设备设计,而且为多用途应用提供了可定制的解决方案。
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来源期刊
IEEE Journal of the Electron Devices Society
IEEE Journal of the Electron Devices Society Biochemistry, Genetics and Molecular Biology-Biotechnology
CiteScore
5.20
自引率
4.30%
发文量
124
审稿时长
9 weeks
期刊介绍: The IEEE Journal of the Electron Devices Society (J-EDS) is an open-access, fully electronic scientific journal publishing papers ranging from fundamental to applied research that are scientifically rigorous and relevant to electron devices. The J-EDS publishes original and significant contributions relating to the theory, modelling, design, performance, and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanodevices, optoelectronics, photovoltaics, power IC''s, and micro-sensors. Tutorial and review papers on these subjects are, also, published. And, occasionally special issues with a collection of papers on particular areas in more depth and breadth are, also, published. J-EDS publishes all papers that are judged to be technically valid and original.
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