Packaged Quasi-Circulators With Low NF and High Isolation Considering the Fabrication Tolerance

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-02-25 DOI:10.1109/TCPMT.2025.3545060

Zhan Chen;Chun-Xia Zhou;Wen Wu

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引用次数: 0

Abstract

A packaged quasi-circulator (QC) with low noise, low insertion loss (IL), high isolation, and ease of manufacturing is proposed in this letter. The proposed QC is constructed by two couplers, three connecting transmission lines (TLs), and a common-emitter amplifier. High isolation between transmitter (TX) and receiver (RX) ports can be obtained using two-way signal cancellation by designing the amplitude and phase of the amplifier, while the noise from the amplifier is suppressed by the isolation of the coupler. The negative group delay (NGD) technique is introduced to change the slope of the loop phase to improve the TX-ANT transmission bandwidth. Furthermore, a reconfigurable load is employed to ensure high isolation within a wide frequency range since the isolation performance is sensitive to the fabrication tolerance. For design validation, a QC is designed and fabricated, which achieves the in-band TX-ANT IL of 2.1 dB, ANT-RX IL of 1.7 dB, and noise figure (NF) of 2.3 dB. By tuning two controlling voltage of varactors, the proposed circulator can obtain >40 dB isolation in the frequency range of 1.925–2.09 GHz.

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.