{"title":"A High-Voltage Low-Dropout Regulator With Wide Ranges of Output Capacitance and Au80Sn20 Alloy Solder for Packaging","authors":"Hua Fan;Xiaopeng Diao;Qi Wei;Quanyuan Feng","doi":"10.1109/TCPMT.2025.3546032","DOIUrl":null,"url":null,"abstract":"This article presents the circuit design and the implementation of a low-dropout (LDO) regulator with high-voltage operation across a broad temperature range from <inline-formula> <tex-math>$- 55~^{\\circ } {\\mathrm {C}}$ </tex-math></inline-formula> to <inline-formula> <tex-math>$125~^{\\circ } {\\mathrm {C}}$ </tex-math></inline-formula>. The proposed LDO operates stably over wide ranges of output capacitance <inline-formula> <tex-math>$C\\rm _{OUT}$ </tex-math></inline-formula> (from 1 to <inline-formula> <tex-math>$100~\\mu $ </tex-math></inline-formula>F) and effective series resistance (ESR; from tens of milliohms ceramic capacitor to several ohms aluminum electrolytic capacitor). This LDO consumes not more than 200-<inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>A quiescent current. This low quiescent current is obtained by replacing the traditional high-voltage p-n-p bipolar power transistor with a p-type laterally diffused MOS (LDMOS) counterpart, reducing the quiescent current from tens of milliamperes to hundreds of microamperes. At the same time, the degradation of the transient response caused by the large gate capacitor of the p-type LDMOS power transistor is mitigated by an operational amplifier with a specially designed feedback path, class-AB bipolar driver, and dynamic bias. The measurement results show that when the load current jumps from 5 to 750 mA within <inline-formula> <tex-math>$3~\\mu \\text {s}$ </tex-math></inline-formula>, the output voltage overshoot remains as low as 50 mV with a <inline-formula> <tex-math>$1~\\mu $ </tex-math></inline-formula>F of output capacitance <inline-formula> <tex-math>$C\\rm _{OUT}$ </tex-math></inline-formula>.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 4","pages":"774-781"},"PeriodicalIF":2.3000,"publicationDate":"2025-02-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10904898/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This article presents the circuit design and the implementation of a low-dropout (LDO) regulator with high-voltage operation across a broad temperature range from $- 55~^{\circ } {\mathrm {C}}$ to $125~^{\circ } {\mathrm {C}}$ . The proposed LDO operates stably over wide ranges of output capacitance $C\rm _{OUT}$ (from 1 to $100~\mu $ F) and effective series resistance (ESR; from tens of milliohms ceramic capacitor to several ohms aluminum electrolytic capacitor). This LDO consumes not more than 200-$\mu $ A quiescent current. This low quiescent current is obtained by replacing the traditional high-voltage p-n-p bipolar power transistor with a p-type laterally diffused MOS (LDMOS) counterpart, reducing the quiescent current from tens of milliamperes to hundreds of microamperes. At the same time, the degradation of the transient response caused by the large gate capacitor of the p-type LDMOS power transistor is mitigated by an operational amplifier with a specially designed feedback path, class-AB bipolar driver, and dynamic bias. The measurement results show that when the load current jumps from 5 to 750 mA within $3~\mu \text {s}$ , the output voltage overshoot remains as low as 50 mV with a $1~\mu $ F of output capacitance $C\rm _{OUT}$ .
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.