A Bandpass Power Combined Amplifier Based on All-Ports Reflectionless Filtering Power Divider

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Guo-Qing Zhou;Jin Xu;Jia-Hao Su;Zi-Hao Zhou;Hui-Kun Yang;Shi-Xin Meng
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Abstract

This article proposed a bandpass power combined amplifier (BPCA) based on an all-ports reflectionless filtering power divider (ARFPD). The ARFPD integrates the functions of filtering, power division/combination, and stopband signal absorption. In addition, to verify the proposed BPCA, a low-voltage 3–4GHz continuous Class-F power amplifier (PA) using a gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (pHEMT) was designed. The proposed BPCA has the characteristics of good filtering, harmonic suppression, and out-of-band absorption. To validate the proposed structure, the ARFPD, continuous Class-F PA, and BPCA in the 3–4GHz frequency range were fabricated and tested. The test results show that the ARFPD has an insertion loss of 3.8 dB, an input return loss of better than 11.6 dB across all frequency band (0–7 GHz),and an isolation and output return loss (ORL) of better than 18 dB within the band. The BPCA has achieved input and ORL better than 10 dB up to 8GHz, a maximum DE of 55.7%, a maximum ${P} _{\text {out}}$ of 28.2 dBm, as well as a harmonic suppression level of 33dBc up to the tenth-harmonic frequency.
本文提出了一种基于全端口无反射滤波功率分配器(ARFPD)的带通功率组合放大器(BPCA)。ARFPD 集成了滤波、功率分配/组合和阻带信号吸收功能。此外,为了验证所提出的 BPCA,还设计了一个使用砷化镓(GaAs)拟态高电子迁移率晶体管(pHEMT)的低电压 3-4GHz 连续 F 类功率放大器(PA)。所提出的 BPCA 具有良好的滤波、谐波抑制和带外吸收特性。为了验证所提出的结构,制作并测试了 3-4GHz 频率范围内的 ARFPD、连续 F 类功率放大器和 BPCA。测试结果表明,ARFPD 的插入损耗为 3.8 dB,在所有频段(0-7 GHz)的输入回波损耗优于 11.6 dB,在频段内的隔离度和输出回波损耗(ORL)优于 18 dB。BPCA 在 8 GHz 以下的输入和输出回波损耗均优于 10 dB,最大 DE 为 55.7%,最大 ${P} _{\text {out}} 为 ${P} _{\text {out}} 。_{text/{out}}$为 28.2 dBm,谐波抑制水平为 33dBc,最高可达十次谐波频率。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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