Current Advances and Outlooks in Hybrid Bonding

Abstract

In this study, the recent advances and trends of Cu-Cu hybrid bonding (HB) will be investigated. Emphasis is placed on the design, materials, process, fabrications, reliability, challenges (opportunities), advantages and disadvantages, and examples of Cu-Cu bumpless HB. Specially, the works by Sony, CEA-Leti, Samsung, imec, Brewer Science, EVG, Yokohama National University, University of Tsukuba, SUSS MicroTec, Micron, Intel, Washington State University, Arizona State University, Applied Materials, National Yang Ming Chiao Tung University (NYCU), Synopsys Inc., BE Semiconductor Industries, TSMC, AMD, ASE, Tokyo Electron America, Fraunhofer IZM, AIST, Okamoto Machine Tool Works, SUNY Binghamton, IBM Research, Daicel, Mitsui, Industrial Technology Research Institute (ITRI), Nanya Technology Corporation (NTC), Brewer Science, Tsinghua University, and Semiconductor Technology Innovation Center will be discussed. Also, some recommendations will be provided.