Smartphone Antenna on Display (AoD) Design at Millimeter-Wave Frequencies With Enhanced Transparency and Ground Plane

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-03-05 DOI:10.1109/TCPMT.2025.3548459

Hsi-Tseng Chou;Chen-Yi Chang;Chao-Wei Yeh;Yu-Ling Yeh;Yu-En Liu

{"title":"Smartphone Antenna on Display (AoD) Design at Millimeter-Wave Frequencies With Enhanced Transparency and Ground Plane","authors":"Hsi-Tseng Chou;Chen-Yi Chang;Chao-Wei Yeh;Yu-Ling Yeh;Yu-En Liu","doi":"10.1109/TCPMT.2025.3548459","DOIUrl":null,"url":null,"abstract":"Antenna on display (AoD) for user equipment (UE) is attractive but faces challenges in implementation. Key factors impacting the AoD implementation are examined in this article. To illustrate the basic behaviors and demonstrate its feasibility, a <inline-formula> <tex-math>$1\\times 4$ </tex-math></inline-formula> optically invisible antenna array is designed, fabricated, and implemented on a display panel at a 5G millimeter-wave (mm-wave) frequency band of 28 GHz. Metal mesh is used as a conductor in the antenna design to provide a high transmittance of around 88%. Novel dummy metal grids of electromagnetic (EM) transparency are added around antennas to increase the optical invisibility of AoD. Moreover, an mm-wave beamforming board and a feeding network on a flexible printed circuit (FPC) board are implemented to emulate the actual scenario for the AoD design. The maximum antenna gain of 7.36 dBi for a <inline-formula> <tex-math>$1\\times 4$ </tex-math></inline-formula> optically invisible antenna array has been achieved with the scanning range between ±30°.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 4","pages":"632-639"},"PeriodicalIF":2.3000,"publicationDate":"2025-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10912518/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

Antenna on display (AoD) for user equipment (UE) is attractive but faces challenges in implementation. Key factors impacting the AoD implementation are examined in this article. To illustrate the basic behaviors and demonstrate its feasibility, a

$1\times 4$

optically invisible antenna array is designed, fabricated, and implemented on a display panel at a 5G millimeter-wave (mm-wave) frequency band of 28 GHz. Metal mesh is used as a conductor in the antenna design to provide a high transmittance of around 88%. Novel dummy metal grids of electromagnetic (EM) transparency are added around antennas to increase the optical invisibility of AoD. Moreover, an mm-wave beamforming board and a feeding network on a flexible printed circuit (FPC) board are implemented to emulate the actual scenario for the AoD design. The maximum antenna gain of 7.36 dBi for a

$1\times 4$

optically invisible antenna array has been achieved with the scanning range between ±30°.

查看原文本刊更多论文

毫米波频率下的智能手机显示屏天线 (AoD) 设计，具有更高的透明度和地平面

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.