TLM-based numerical extraction for CMOS-compatible N+-InGaAs ohmic contacts on 200mm Si substrates

IF 1.4 4区 物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
A. Lombrez , A. Divay , H. Boutry , L. Colas , N. Coudurier , S. Altazin , T. Baron
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引用次数: 0

Abstract

We report the results of a TLM-based numerical extraction methodology applied on CMOS-compatible N+-InGaAs ohmic contacts integrated with dielectrics on 200mm Si substrates. The methodology is first described and calibrated using contacts on SOI. Then, we applied this method on W/TiN/Ti on N+-InGaAs contacts to obtain state-of-the-art level ρc = 7,5.10-8 Ω.cm2 for 0.35x0.35µm contact dimension, which is close to relevant contact size of the targeted application (THz HBT for 6G).
基于tlm的200mm Si衬底上cmos兼容N+-InGaAs欧姆触点的数值提取
我们报告了一种基于tlm的数值提取方法的结果,该方法应用于cmos兼容的N+-InGaAs欧姆触点与200mm Si衬底上的介电体集成。首先描述了该方法,并使用SOI上的触点进行了校准。然后,我们将该方法应用于W/TiN/Ti on N+-InGaAs触点上,得到了最先进水平的ρc = 7,5.10-8 Ω。接触尺寸为0.35x0.35µm,接近目标应用的相关接触尺寸(6G太赫兹HBT)。
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来源期刊
Solid-state Electronics
Solid-state Electronics 物理-工程:电子与电气
CiteScore
3.00
自引率
5.90%
发文量
212
审稿时长
3 months
期刊介绍: It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.
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