Ultimate thermal stress reliability evaluation of 3D packaged memory

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-04-10 DOI:10.1016/j.microrel.2025.115702

Shuai Zhou , Kaixue Ma , Yugong Wu , Shoufu Liu , Chi Ma

引用次数: 0

Abstract

This study evaluates the thermal stress reliability of 3D packaged memory under extreme temperature environments (−65 °C to 175 °C). Combining finite element simulation and experimental validation, we demonstrate that thermal shock induces higher stress (12–14 % increase) and shorter lifespan (25 % reduction) compared to temperature cycling. The Darveaux model accurately predicted failure cycles with <10 % error, supported by SEM analysis of creep and crack propagation mechanisms. These findings provide critical insights for designing robust 3D packages in aerospace and AI systems.

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三维封装存储器极限热应力可靠性评价

该研究评估了3D封装存储器在极端温度环境（- 65°C至175°C）下的热应力可靠性。结合有限元模拟和实验验证，我们证明了与温度循环相比，热冲击导致更高的应力（增加12 - 14%）和更短的寿命（减少25%）。在蠕变和裂纹扩展机制的SEM分析支持下，Darveaux模型准确预测了失效周期，误差为10%。这些发现为在航空航天和人工智能系统中设计强大的3D封装提供了重要的见解。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.