{"title":"Localizing Multiple Bugs in RTL Designs by Classifying Hit-Statements Using Neural Networks","authors":"Mahsa Heidari;Bijan Alizadeh","doi":"10.1109/TC.2025.3543609","DOIUrl":null,"url":null,"abstract":"Nowadays the advanced applications required in our lives have led to a significant increase in the complexity of circuits, which enhances the possibility of occurring design errors. Hence an automated, powerful, and scalable debugging approach is needed. Therefore, this paper proposes a scalable approach for localizing multiple bugs in Register-Transfer level (RTL) designs by using neural networks. The main idea is that hit-statements which are covered by failed test-vectors are more suspicious than those covered by passed test-vectors. We use coverage data as samples of our data set, label these samples, and tune the neural network model. Then we encode hit-statements and give them to the tuned model as new samples. The model classifies hit-statements. Hit-statements that take the failed labels, labels related to the failed test-vectors, are more suspicious of containing bugs. The results demonstrate that the proposed methodology outperforms recent approaches Tarsel and CirFix by localizing 80% of bugs at Top-1. The results also imply that our methodology increases the F<sub>1</sub>-score metric by 1.13× in comparison with existing RTL debugging techniques, which are prediction-based.","PeriodicalId":13087,"journal":{"name":"IEEE Transactions on Computers","volume":"74 5","pages":"1786-1799"},"PeriodicalIF":3.6000,"publicationDate":"2025-02-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Computers","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10892347/","RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
Nowadays the advanced applications required in our lives have led to a significant increase in the complexity of circuits, which enhances the possibility of occurring design errors. Hence an automated, powerful, and scalable debugging approach is needed. Therefore, this paper proposes a scalable approach for localizing multiple bugs in Register-Transfer level (RTL) designs by using neural networks. The main idea is that hit-statements which are covered by failed test-vectors are more suspicious than those covered by passed test-vectors. We use coverage data as samples of our data set, label these samples, and tune the neural network model. Then we encode hit-statements and give them to the tuned model as new samples. The model classifies hit-statements. Hit-statements that take the failed labels, labels related to the failed test-vectors, are more suspicious of containing bugs. The results demonstrate that the proposed methodology outperforms recent approaches Tarsel and CirFix by localizing 80% of bugs at Top-1. The results also imply that our methodology increases the F1-score metric by 1.13× in comparison with existing RTL debugging techniques, which are prediction-based.
期刊介绍:
The IEEE Transactions on Computers is a monthly publication with a wide distribution to researchers, developers, technical managers, and educators in the computer field. It publishes papers on research in areas of current interest to the readers. These areas include, but are not limited to, the following: a) computer organizations and architectures; b) operating systems, software systems, and communication protocols; c) real-time systems and embedded systems; d) digital devices, computer components, and interconnection networks; e) specification, design, prototyping, and testing methods and tools; f) performance, fault tolerance, reliability, security, and testability; g) case studies and experimental and theoretical evaluations; and h) new and important applications and trends.