Thermal Plasma-Induced High Temperature Insulation Gas Generation for Dielectric Property Measurement above 3000 K

IF 2.6 3区物理与天体物理 Q3 ENGINEERING, CHEMICAL

Plasma Chemistry and Plasma Processing Pub Date : 2025-03-04 DOI:10.1007/s11090-025-10553-4

Koya Ishinokoshi, Rio Okano, Yasunori Tanaka, Tatsuo Ishijima, Yusuke Nakano

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引用次数: 0

Abstract

A novel method for generating high-temperature gas using a tandem-type inductively coupled thermal plasma (Tandem-ICTP), composed of two vertically arranged coils, was proposed to experimentally evaluate the dielectric properties of hot gases. The dielectric properties of high-temperature insulation gases are critical for determining the success or failure of current interruption in gas circuit breakers (GCBs). In this study, we focused on the detailed investigation of the high-temperature gas field generated by Tandem-ICTP. The temperature of \(\hbox {CO}_2\) gas, heated by varying the lower-coil input power in the Tandem-ICTP system, was estimated using spectroscopic measurements at the electrode position, applying the Boltzmann plot method. Additionally, an electromagnetic thermofluid simulation was conducted to support the experimentally measured temperatures and to estimate the mole concentration of \(\hbox {CO}_2\) gas between the electrodes. The results revealed that the temperature of the \(\hbox {CO}_2\) gas could exceed 3800 K using the Tandem-ICTP and could be adjusted by approximately 2600 K by modifying the input power of lower-coil. Furthermore, the mole concentration of high-temperature \(\hbox {CO}_2\) gas between the electrodes was found to be approximately 40\(\%\), as determined by numerical simulation. This method demonstrates that a dielectric test can be conducted in the wide range of high-temperature gas fields above 3000 K by controlling parameters such as the input power of lower-coil in the Tandem-ICTP system.

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来源期刊

Plasma Chemistry and Plasma Processing 工程技术-工程：化工

CiteScore

5.90

自引率

8.30%

发文量

审稿时长

6-12 weeks

期刊介绍： Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.